Annular Heater Electrode Movable Groove Thermal Deformation
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Solution Overview
Problem
The existing backside heating methods for semiconductor devices face challenges in maintaining heater element integrity and preventing short circuits due to thermal deformation, leading to reduced productivity and unstable film formation.
Innovation Solution
An apparatus with an out-heater having an annular heater element and integrally formed heater electrode parts at both ends, where the second heater electrode part is movably disposed in a wider groove to accommodate circumferential deformation, preventing damage and short circuits by allowing the electrode components to follow the heater element's expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heater element is heated to high temperature for film formation, then the film formation process can be performed, but the heater element deforms in the circumferential direction causing damage or short circuit
Solution Approach 1:
The second electrode component is made movable along the circumferential direction to dynamically follow the thermal deformation of the heater element, preventing damage while maintaining electrical connection at high temperatures
Solution Approach 2:
The groove width for the second electrode component is designed to be larger than that for the first electrode component, allowing the electrode to move and accommodate thermal expansion parameters
2Stability of the object's composition
If the heater electrode part is fixed rigidly to prevent movement, then electrical connection is stable, but the heater element cannot accommodate thermal deformation and may be damaged
Solution Approach 1:
The second electrode component is designed to move along the circumferential direction to follow thermal deformation, while the first electrode component remains fixed to provide stable electrical connection
Solution Approach 2:
The electrode components are divided into two types with different fixation methods: the first electrode component is fixedly disposed for stability, while the second electrode component is movably disposed for deformation accommodation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables stable and high-productivity film formation by preventing damage to the heater elements and maintaining electrical isolation, thereby improving the yield and device characteristics of semiconductor devices.
Implementation Method 1
a heater element with a slit engraved in a circular flat plate is used, and a heater electrode part is provided at a symmetrical position centering on the heater element
Implementation Method 2
the deformation of the heater element due to a temperature increase occurs in a direction (circumferential direction) in which the end portions expand
Implementation Method 3
supplies process gas using a single-wafer type epitaxial film formation apparatus, for example, while rotating at a high speed of 900 rpm or more within a reaction chamber
Data Source
AI summary
An apparatus for manufacturing a semiconductor device includes an out-heater including a heater element formed in an annular shape with a disconnected portion at one place, a first electrode component connected to a first heater electrode part of the heater element, a second electrode component connected to a second heater electrode part of the heater element, and a base including a first groove in which the first electrode component is fixedly disposed, and a second groove in which the second electrode component is movably disposed and a groove width in a circumferential direction of the heater element is formed such that a width of a second gap formed between a side of the second electrode component and an inner wall of the groove is wider than a width of a first gap formed between a side of the first electrode component and an inner wall of the first groove.