Heating Plate Heater Control for Uniform Substrate Temperature
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Solution Overview
Problem
In substrate heating processes for semiconductor and display panel manufacturing, the temperature profiles of multiple heaters on a heating plate do not match quickly after a substrate is placed, leading to uneven heating and increased processing time, which is problematic for high-precision applications like ArF and EUV exposing processes.
Innovation Solution
A method and apparatus where the target temperatures of heaters are dynamically adjusted based on measured temperatures and temperature change profiles, with different initial target temperatures set for each heater to ensure rapid matching of temperature profiles, allowing for uniform heating by controlling the power applied to each heater.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple heaters are installed on the heating plate to heat different regions of the substrate, then the substrate can be uniformly heated for each region, but the temperature profiles of the heaters do not match quickly after substrate placement, causing extended processing time
Solution Approach 1:
The control method performs preliminary actions by predicting future temperature deviations and adjusting heater outputs in advance. Before the substrate is placed on the heating plate, the controller calculates predicted temperature deviations for each heater and adjusts their outputs accordingly, so that when the substrate is placed, the temperature profiles match more quickly without requiring extended processing time.
Solution Approach 2:
The system dynamically adjusts the output of each heater based on real-time temperature measurements and predicted deviations. The control method continuously monitors actual temperatures, compares them with target temperatures, and modifies heater outputs dynamically during the heating process, allowing the system to adapt to changing conditions and achieve uniform heating faster.
2Reliability
If the target temperature of each heater is constantly maintained at a set temperature, then the heater output can be feedback-controlled, but the temperature deviation between heaters increases during the transitional period after substrate placement
Solution Approach 1:
The controller performs preliminary calculations to predict temperature deviations for each heater before the substrate is placed. By anticipating which heaters will deviate from target temperature and by how much, the system pre-adjusts their outputs to compensate for expected variations, maintaining both feedback control stability and temperature uniformity across all heaters.
Solution Approach 2:
The control method applies different control strategies to different heaters based on their specific characteristics and positions. Each heater's output is independently adjusted according to its predicted temperature deviation, allowing localized optimization of temperature control for each heater while maintaining overall system stability.
3Productivity
If a low-temperature substrate is placed on the heating plate, then the substrate can be heated, but the heater temperatures undershoot and overshoot from the set temperature, requiring additional time to stabilize
Solution Approach 1:
The system performs preliminary adjustments to heater outputs based on predicted temperature deviations caused by substrate placement. By pre-compensating for the thermal shock that occurs when a cold substrate is placed on hot heaters, the system prevents undershoot and overshoot conditions, allowing the heaters to maintain stable temperatures without requiring extended stabilization time.
Solution Approach 2:
The control method applies preliminary counter-actions to prevent the adverse effects of substrate placement. By predicting and compensating for the temperature drops that will occur when the substrate is placed, the system pre-adjusts heater outputs in the opposite direction of the expected deviation, canceling out the undershoot and overshoot effects before they occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables quick matching of temperature profiles across heaters, reducing the time for uniform substrate heating and enhancing the precision and efficiency of the heating process, particularly in high-precision applications.
Implementation Method 1
a heater generating a heat is installed, and the heater generates the heat to heat the substrate
Implementation Method 2
the substrate is placed on a heating plate on which a heater generating a heat is installed
Data Source
AI summary
The inventive concept provides a substrate treating method. The substrate treating method includes measuring a temperature of a plurality of heaters installed on a heating plate for heating a substrate; and heating the substrate by adjusting an output of the heater based on a difference between a measured temperature of each heater and a target temperature of each heater which was previously modelled, and wherein a target temperature of a first heater among the heaters at a first time point is set differently from the target temperature of the first heater at a second time point which is later than the first time point.