Heating Unit for Uniform Dielectric Plate Temperature
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Solution Overview
Problem
In plasma processing for semiconductor manufacturing, the temperature distribution across dielectric windows in Inductively Coupled Plasma (ICP) systems is uneven, leading to inefficiencies in substrate treatment due to varying temperatures within the chamber.
Innovation Solution
A substrate treating apparatus with a heating unit that includes multiple lamps and a radiation angle limiting unit to uniformly heat the dielectric plate, using a ring-shaped configuration and reflection members to control temperature distribution, ensuring consistent heating across the dielectric plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is provided to surround a dielectric window outside a conventional dielectric window to heat the dielectric window, then the dielectric window can be heated, but a center area of the dielectric window is heated less than an edge portion of the dielectric window, thereby lowering process efficiency
Solution Approach 1:
The patent applies local quality by providing separate heating control for different regions of the dielectric window. Specifically, edge heating units are positioned to primarily heat the edge portions, while center heating units are positioned to primarily heat the center area. This allows each region to receive appropriate heating intensity, ensuring uniform temperature distribution across the entire dielectric window surface.
Solution Approach 2:
The heating system is segmented into multiple independent heating units: first heating units for the center area and second heating units for the edge portions. Each heating unit can be independently controlled, allowing precise temperature management for different regions. This segmentation resolves the contradiction by enabling simultaneous optimization of heating for both center and edge areas.
2Temperature
If multiple heating units are provided to heat different areas of the dielectric plate, then temperature distribution can be made uniform, but the device complexity increases
Solution Approach 1:
The heating units are designed with multi-functionality to reduce overall system complexity. The same type of heating unit structure is used for both center and edge areas, differing only in their positioning and control parameters. This universal design approach allows for simplified manufacturing, maintenance, and control while achieving uniform temperature distribution across the dielectric plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise temperature control and uniform heating of the dielectric plate, enhancing process efficiency and maintaining a consistent temperature, thereby improving the overall plasma treatment process.
Implementation Method 1
a heating unit configured to heat the dielectric plate
Implementation Method 2
an inner wall of the housing may be formed of a material of reflecting the light
Implementation Method 3
plasma means ionized gas formed of ions, electrons, radicals, etc. The plasma is created by very high temperature, strong electric field or high-frequency electric and magnetic field
Implementation Method 4
Inductively Coupled Plasma (ICP) process apparatus uses a dielectric window as a transfer path of a high-frequency power
Data Source
AI summary
Disclosed is a substrate treating apparatus which includes a chamber, a support unit, a dielectric plate, a gas supplying unit, an antenna, and a heating unit. The chamber has a processing space therein, and an upper surface of the processing space is opened. The support unit is disposed in the chamber and supports a substrate. The dielectric plate is installed on the opened upper surface of the chamber to cover the opened upper surface. The gas supplying unit supplies a gas in the chamber. The antenna is disposed above the dielectric plate and creates plasma from the gas. The heating unit is disposed above the antenna and heats the dielectric plate.