Enhancement-Mode HEMT With Segmented AlGaN Barrier

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Solution Overview

Problem

Conventional enhancement-mode high electron mobility transistors (HEMTs) have threshold voltages less than 1 V, limiting their control and on-state resistance, which is similar to depletion-mode HEMTs with unintentionally doped GaN channel layers and AlGaN barrier layers.

Innovation Solution

The development of an enhancement-mode HEMT with a first III-V material layer, a second layer having higher Al content, and a third layer with lower Al content, where the third layer is disposed between the source and drain electrodes, and includes AlzGa(1-z)N with 0.00≤z≤0.10, to achieve a threshold voltage greater than 1 V and similar on-state resistance to depletion-mode HEMTs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If conventional enhancement-mode HEMT structure is used, then device complexity is reduced, but threshold voltage control is insufficient (threshold voltage less than 1 V)

Engineering Contradiction:
Improvethreshold voltage controlVSAvoidtransistor structure complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The barrier layer is segmented into multiple distinct layers with different aluminum compositions. The first barrier layer has a first aluminum composition and the second barrier layer has a second aluminum composition, creating multiple heterojunctions that enable independent control of threshold voltage while maintaining structural organization

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the barrier layer are assigned different aluminum compositions to achieve local optimization. The first barrier layer region has specific aluminum content for one function, while the second barrier layer region has different aluminum content for another function, allowing precise local control of electrical properties

Inventive Principle:
Principle #3Local quality

2Reliability

If depletion-mode HEMT structure is used, then on-state resistance is improved, but threshold voltage control remains limited

Engineering Contradiction:
Improveon-state resistanceVSAvoidthreshold voltage control
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The barrier structure uses composite material design with two different AlGaN layers having distinct aluminum compositions. This composite structure combines the benefits of low on-state resistance from optimized barrier properties with enhanced threshold voltage control from the multi-layer configuration

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for better control of the HEMT with a threshold voltage greater than 1 V and similar on-state resistance to depletion-mode HEMTs, enhancing the performance of enhancement-mode HEMTs.

Implementation Method 1

a two dimension electron gas is at a heterojunction between a GaN channel layer and an AlGaN barrier layer

Methodology Applied
Scientific EffectHeterojunction:

Implementation Method 2

A high electron mobility transistor can include a GaN channel layer and an overlying AlGaN barrier layer

Methodology Applied
Scientific EffectHigh electron mobility:

Data Source

PatentUS10269947B1Electronic device including a transistor including III-V materials and a process of forming the same
Publication Date: 2019.04.23 SEMICON COMPONENTS IND LLC
  • US10269947B1 patent drawing
  • US10269947B1 patent drawing

AI summary

An electronic device can include a transistor. The transistor can include a first layer including a first III-V material, a second layer overlying the first layer and including a second III-V material, and a third layer overlying the first layer and including a third III-V material. In an embodiment, each of the first and second layers includes Al, and the second layer has a higher Al content as compared to the first layer. In another embodiment, the transistor can further include a gate dielectric layer overlying the third layer, and a gate electrode of the transistor overlying the gate dielectric layer and the third layer. The transistor can be an enhancement-mode high electron mobility transistor. The configuration of layers can allow for a relatively higher threshold voltage, as compared to conventional enhancement-mode high electron mobility transistor, to be achieved without significantly affecting RDSON.