Hermetic Encapsulation of Active Elements in Implantable Medical Devices
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Solution Overview
Problem
Existing methods for encapsulating active elements in medical devices implanted in the body are complex and costly, requiring double protection against biological environments and involving intricate processes like silicon or quartz stacks with conductive vias, which are expensive and difficult to implement.
Innovation Solution
A biocompatible component with an active element hermetically encapsulated in a cavity between a conductive support and cover, using separate electrical connections that eliminate the need for conductive vias, where the support and cover are made of electrically conductive materials and are electrically isolated from each other, with a dielectric layer securing the active element and providing hermetic attachment through a conductive sealing bead.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive vias are used to connect active element to exterior, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts the conductive via structure from the encapsulation system and replaces it with a sealing bead made of conductive material. This eliminates the complex via formation process while maintaining both electrical connectivity and hermetic sealing through the bead that simultaneously closes the opening and provides conductive path.
Solution Approach 2:
The sealing bead performs multiple functions simultaneously: it hermetically seals the opening in the encapsulation layer, provides electrical connection between the active element and exterior, and maintains structural integrity. This multi-functional element replaces the separate via structure, reducing manufacturing complexity while ensuring reliability.
2Reliability
If double protection encapsulation is implemented, then biocompatibility is improved, but device complexity increases
Solution Approach 1:
The invention merges the electrical connection function with the hermetic sealing function into a single integrated structure - the conductive sealing bead. This eliminates the need for separate via structures and reduces the overall encapsulation complexity while maintaining the required double protection for biocompatibility.
Solution Approach 2:
The invention applies local quality by making the sealing bead itself conductive rather than requiring a through-opening via structure. This localized conductive property within the sealing element provides electrical connection exactly where needed while the rest of the encapsulation maintains its hermetic barrier function.
3Reliability
If hermetic sealing is ensured with controlled leakage rate, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive sealing bead acts as a permanent seal that eliminates the need for precision-controlled leakage rates. By providing a complete hermetic barrier through the bead, the system achieves reliability without requiring ultra-precise manufacturing tolerances for leakage control, simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the production of biocompatible medical devices by allowing all or most of the surface to form electrical accesses, reducing production complexity and cost, while maintaining hermeticity and biocompatibility, thus enhancing the reliability and affordability of implantable medical devices.
Implementation Method 1
the support and the cover are made of electrically conductive materials and are electrically isolated from each other
Implementation Method 2
in electrical contact with an electrically conductive sealing bead providing hermetic attachment of the cover to the support
Data Source
Figure 1A~2
Figure 3A~4
Figure 5~6
AI summary
Component (100) comprising an active element (106) hermetically encapsulated in a cavity (116) formed between a support (102) and a cover (114), wherein the support and the cover are made of an electrically conductive material and are electrically insulated from each other, and comprising a first electrical connection between the active element and the support, and a second electrical connection, distinct from the first connection, between the active element and the cover, and wherein: - the active element is secured to the support by means of a dielectric layer (104) disposed between the support and the active element, and between the support and the cover; - the second electrical connection comprises a second portion (210) of electrically conductive material electrically connected to the cover, disposed on the dielectric layer and in electrical contact with an electrically conductive sealing cord (118) ensuring a hermetic connection of the cover to the support.