Hermetic Flex Lead-Out Structure With Integrated Feed-Through Sealing
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Solution Overview
Problem
Existing hermetic apparatuses face complexity and increased space occupation due to multiple electrical connectors in the electrical lead-out structures, hindering miniaturization and assembly efficiency, particularly in high-hermeticity requirements like wavelength selective switches.
Innovation Solution
An electrical lead-out structure with a flexible circuit board and packaging layer, where the packaging layer is soldered to a hermetic housing, integrating feed-through areas for direct hermeticity, eliminating the need for multiple interconnections and reducing the structure's complexity and space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple electrical connectors are used for interconnection in the electrical lead-out structure, then electrical connection reliability is improved, but device complexity and occupied space increase
Solution Approach 1:
The patent merges the electrical connector and the hermetic seal into a single integrated component. The electrical connector includes a hermetic seal structure that is directly formed as part of the connector body, eliminating the need for separate hermetic sealing components. This integration reduces the number of parts and simplifies the overall structure while maintaining both electrical connection reliability and hermeticity.
Solution Approach 2:
The electrical connector is designed to perform multiple functions simultaneously: electrical connection, hermetic sealing, and mechanical support. The connector body integrates conductive elements for electrical signals with hermetic seal structures, allowing a single component to fulfill roles that previously required separate parts. This multi-functionality reduces device complexity while ensuring reliable electrical and hermetic performance.
2Reliability
If multiple electrical connectors are used for interconnection, then electrical connection reliability is improved, but occupied space increases
Solution Approach 1:
By combining the electrical connector and hermetic seal into one integrated component, the patent eliminates the space that would be occupied by separate components. The connector body is designed to fit directly into the hermetic package structure, reducing the overall volume required for the electrical lead-out structure while maintaining reliable electrical connections.
3Reliability
If traditional interconnection methods with pin receptacles are used, then electrical connection is achieved, but assembly efficiency decreases and structure becomes complex
Solution Approach 1:
The integration of the hermetic seal into the electrical connector body eliminates multiple assembly steps. Instead of assembling separate connectors and seals, the integrated structure is installed as a single unit, significantly improving assembly efficiency. The connector can be directly mounted through the hermetic package wall without requiring separate hermetic sealing operations.
Solution Approach 2:
The hermetic seal structure is pre-formed as an integral part of the electrical connector body during the connector manufacturing process. This preliminary integration of hermetic sealing features into the connector design allows for faster assembly, as the sealing function is already built-in and requires no additional assembly steps during device fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the structure, reduces space occupation, and enhances assembly efficiency by integrating components, allowing for miniaturization and improved hermeticity in hermetic apparatuses.
Implementation Method 1
the packaging layer is configured to be soldered to a hermetic housing, to implement a hermetic connection between the electrical lead-out structure and the hermetic housing
Data Source
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AI summary
This application provides an electrical lead-out structure and a preparation method thereof, a hermetic apparatus, and an optical communication device. The electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up, the reinforcing layer is provided with a window that passes through the reinforcing layer, the electrical signal layer is adjacent to the window, the packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. The packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed. "Through-wall" hermeticity is directly implemented by using the feed-through area. In other words, in the electrical lead-out structure, structures soldered to the hermetic housing are integrated together. In this way, a plurality of times of interconnection performed through a pin receptacle are not required, and the electrical lead-out structure can perform electrical lead-out without a specially bent layout, to simplify a structure of the electrical lead-out structure and reduce an occupied space of the electrical lead-out structure.