Hermetically Sealed Quantum Dot LED Package
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Solution Overview
Problem
Existing quantum dot films used in LEDs degrade due to exposure to heat and light flux, as well as oxygen and moisture, leading to a significant thickness requirement and material usage, which can be mitigated by hermetically sealing the quantum dots.
Innovation Solution
A hermetically sealed quantum dot LED system is created by positioning a porous material with embedded quantum dots directly on top of the LED die, using a sealant to protect the quantum dots from moisture and oxygen, allowing them to withstand heat and light flux without the need for a separate film, and can be integrated into the LED package or used as a separate layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If quantum dots are positioned closer to the LED to reduce thickness, then device thickness is reduced, but the quantum dots degrade due to heat and light flux from the LED
Solution Approach 1:
The device is segmented into distinct functional zones: the LED chip, the quantum dot layer positioned close to the LED, and an outer protective enclosure. This segmentation allows the quantum dots to be positioned close to the LED for thinness while the protective enclosure handles the heat and environmental protection, resolving the contradiction between thickness reduction and stability maintenance.
Solution Approach 2:
A protective enclosure acts as an intermediary between the LED/quantum dot system and the external environment. This enclosure shields the quantum dots from moisture and oxygen while allowing the device to maintain thin dimensions, thus resolving the contradiction by mediating between the need for close positioning and the need for protection.
2Quantity of substance
If quantum dots are exposed to oxygen and moisture in the air, then material usage is reduced, but the quantum dots degrade rapidly
Solution Approach 1:
A thin protective enclosure (film) is applied over the quantum dot layer to create a hermetic seal. This thin film provides effective protection against oxygen and moisture while using minimal material, thus resolving the contradiction between reducing material usage and maintaining quantum dot stability through environmental protection.
3Reliability
If a separate film is used to incorporate quantum dots, then quantum dots are protected, but device thickness increases significantly
Solution Approach 1:
The protective enclosure is merged with the device packaging structure rather than being a separate additional film. This integration allows the packaging to serve dual functions: protecting the quantum dots from environmental degradation and maintaining thin device dimensions, thus resolving the contradiction between protection and thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution protects quantum dots from degradation, reducing material usage and thickness, while maintaining performance by encapsulating them within a porous material and sealant, enabling direct integration onto the LED die, thus enhancing the stability and efficiency of quantum dot-based LEDs.
Implementation Method 1
A quantum dot material is deposited within the plurality of pores of the porous material
Implementation Method 2
A sealant is disposed on top of the quantum dot material and the porous material in order to hermitically seal the quantum dot material within the plurality of pores. This hermetic seal protects the quantum dots from moisture and oxygen
Data Source
AI summary
Systems and methods for hermetically sealed quantum dots that may be positioned directly on top of the LED, so that a separate film is not needed to incorporate the quantum dots into a light, display, or other LED-based device. An enclosed quantum dot package can be incorporated directly on top of an LED die and packaged in the same packaging as the LED itself. Alternatively, the LED die may be encapsulated in the LED package, and the enclosed quantum dot package may be placed on top of the encapsulated LED. Alternatively, the enclosed quantum dot package may be separate from the encapsulated LED, e.g., included in a device as a separate layer from the LED package(s).


