Hermetic Transceiver Package With Encapsulant Cavity Integration
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Solution Overview
Problem
Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and large package sizes with relatively low performance.
Innovation Solution
The proposed electronic device comprises a substrate with a dielectric and conductive structure, electronic components with transceivers, an encapsulant defining a cavity, and a lid, manufactured through a method involving die attach, underfill, and encapsulation to create a hermetic seal, allowing for efficient integration and protection of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic packages are used, then manufacturing is simpler, but package size is too large and performance is low
Solution Approach 1:
The patent implements nesting by placing electronic components inside a cavity formed within the encapsulant material itself. The cavity is created by forming the encapsulant with an internal void space, allowing components to be embedded within the encapsulant structure rather than surrounding them with a larger package housing. This nested arrangement significantly reduces the overall package volume while maintaining component protection and electrical connections.
2Reliability
If conventional electronic packages are used, then manufacturing is simpler, but reliability is decreased
Solution Approach 1:
The nested component arrangement within the encapsulant cavity provides superior mechanical support and stress distribution. Components are surrounded by the encapsulant material on multiple sides, offering enhanced protection against physical damage, moisture, and contamination. This embedded configuration improves thermal management by providing direct thermal pathways from components to the encapsulant, and enhances electrical reliability through controlled interconnect structures that pass through the encapsulant.
Solution Approach 2:
The cavity is pre-formed within the encapsulant material before component placement. This preliminary action allows for precise positioning and alignment of electronic components within the encapsulant structure, ensuring proper spacing, thermal management pathways, and electrical interconnections are established before final encapsulation. The pre-formed cavity also facilitates automated assembly processes, improving manufacturing reliability.
3Reliability
If conventional electronic packages are used, then manufacturing is simpler, but performance is relatively low
Solution Approach 1:
The nested configuration enables shorter electrical interconnect lengths between components and the substrate, reducing signal transmission delays and impedance mismatches. Components positioned within the encapsulant cavity achieve optimal spacing and orientation, improving electromagnetic compatibility and reducing interference. The direct thermal pathways from embedded components to the encapsulant and substrate enhance heat dissipation efficiency, maintaining lower operating temperatures for improved device performance and longevity.
Data Source
AI summary
In one example, an electronic device comprises a substrate comprising a dielectric structure and a conductive structure, a first electronic component over a top side of the substrate and comprising a first transceiver, wherein the first electronic component is coupled to the conductive structure, a second electronic component coupled to the substrate and the conductive structure and comprising a second transceiver, an encapsulant over the top side of the substrate and defining a cavity, wherein the second transceiver is in the cavity and the first electronic component is covered by the encapsulant, and a lid over the top side of the substrate and covering the second electronic component. Other examples and related methods are also disclosed herein.