Heterojunction Cell UV Surface Treatment for Stronger PV Encapsulation

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Solution Overview

Problem

During the preparation of photovoltaic assemblies, organic components in the slurry tend to volatilize, reducing the surface energy of cell chips and leading to decreased peeling energy between the cell chip and the encapsulating adhesive film layer, which can result in reliability failures, especially under outdoor conditions.

Innovation Solution

A method involving irradiation of cell chips with light in the wavelength range of 200 nm to 500 nm to remove organic dirt and flux residues, enhancing the peeling energy between the cell chip and the encapsulating adhesive film layer, thereby improving the power and reliability of the photovoltaic assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If low-temperature drying and curing process is used, then organic components of slurry are removed, but surface energy of cell chip decreases and peeling energy between cell chip and encapsulating adhesive film layer decreases

Engineering Contradiction:

Improveorganic components removalVSAvoidpeeling energy between cell chip and encapsulating adhesive film layer

Core Design Contradiction:

Loss of substanceVSReliability

Solution Approach 1:

The patent introduces UV irradiation as a new parameter to treat the cell chip surface. By changing the treatment method from thermal (drying/curing) to optical (UV irradiation), the process removes organic components while simultaneously increasing surface energy, thus improving peeling energy and reliability without the adverse effects of temperature-based methods.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal field (heating/drying process) with an optical field (UV irradiation). This substitution allows for effective removal of organic components at low temperatures, preventing surface energy degradation and maintaining high peeling energy between the cell chip and encapsulating adhesive film layer.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Loss of substance

If low-temperature drying and curing process is used, then organic components of slurry are removed, but surface energy of cell chip decreases

Engineering Contradiction:

Improveorganic components removalVSAvoidsurface energy of cell chip

Core Design Contradiction:

Loss of substanceVSManufacturing precision

Solution Approach 1:

The patent changes the processing parameter from temperature-based (thermal drying) to wavelength-based (UV irradiation at 200-500 nm). This parameter change enables effective organic component removal while preserving and even enhancing surface energy, achieving high manufacturing precision in surface quality.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent substitutes thermal processing with optical processing (UV irradiation). This replacement eliminates the temperature-induced surface energy degradation while maintaining effective organic component removal, thus achieving precise control over surface energy characteristics.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional preparation method is used, then manufacturing process is simple, but flux residues remain on cell chip surface and peeling energy decreases

Engineering Contradiction:

Improvepreparation process simplicityVSAvoidpeeling energy between cell chip and encapsulating adhesive film layer

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces UV irradiation as a preliminary treatment step before encapsulation. This pre-treatment removes flux residues and enhances surface energy in advance, ensuring high peeling energy in the final product without complicating the overall manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses UV irradiation as an intermediary process between cell chip preparation and encapsulation. This intermediate step effectively removes organic residues and optimizes surface properties, bridging the gap between simple preparation and high-reliability encapsulation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively increases the peeling energy between the cell chip and the encapsulating adhesive film layer, enhancing the connection reliability and power output of the photovoltaic assembly by removing organic residues and improving surface energy.

Implementation Method 1

irradiating the plurality of cell chips with light having a wavelength in a range of 200 nm to 500 nm... organic dirt on the surface of the cell chips can be removed

Methodology Applied

Scientific EffectPhoto-oxidation: Photo-oxidation

Data Source

PatentUS20240372029A1Photovoltaic assembly preparation method, photovoltaic assembly, and heterojunction cell

Publication Date: 2024.11.07 CANADIAN SOLAR SUNENERGY (JIAXING) CO LTD

AI summary

A method for preparing a photovoltaic assembly, a photovoltaic assembly and a heterojunction cell are disclosed. The method for preparing the photovoltaic assembly includes: preparing a plurality of cell chips; forming a cell string, including connecting the plurality of cell chips by an electrical connector to form the cell string; and irradiating the plurality of cell chips with light, including irradiating the plurality of cell chips with light having a wavelength in a range of 200 nm to 500 nm.