Hexagonal Memory Cell Arrangement for Semiconductor Density
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Solution Overview
Problem
The challenge is to densely arrange memory cells in non-volatile memory without altering the positions of transistors or the shapes of bit line structures, which is essential for increasing memory capacity while maintaining production efficiency and reducing costs.
Innovation Solution
A semiconductor structure is designed with transistors arranged according to a first preset pattern, transistor contact structures with hexagonal top portions, memory cells arranged in a hexagonal pattern, and memory contact structures with top portions following a second preset pattern different from the first. This configuration allows for dense memory cell arrangement without changing the positions or shapes of transistors and bit line structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory cells are densely arranged to increase capacity, then memory capacity is improved, but the positions of transistors and shapes of bit line structures must be adjusted, increasing production cost and process difficulty
Solution Approach 1:
The patent transitions from conventional rectangular grid arrangements to a hexagonal lattice structure for memory cell arrangement. This dimensional geometric change allows memory cells to be densely packed in a honeycomb pattern, achieving higher capacity without requiring changes to transistor positions or bit line structure shapes, thus resolving the contradiction between capacity increase and production complexity
Solution Approach 2:
The hexagonal contact structure serves multiple functions: it provides the connection interface between memory cells and bit lines, defines the dense packing geometry, and maintains compatibility with existing transistor layouts. This multi-functional design allows dense memory arrangement without requiring separate adjustment mechanisms for different components
2Quantity of substance
If memory cells are densely arranged to increase capacity, then memory capacity is improved, but production cost increases due to process difficulty
Solution Approach 1:
By adopting a hexagonal geometric arrangement instead of rectangular, the patent achieves denser memory cell packing while maintaining compatibility with standard manufacturing processes. The hexagonal contact structures can be formed using conventional photolithography and etching techniques, avoiding the need for complex process adjustments that would increase production costs
Data Source
AI summary
The present disclosure relates to a semiconductor structure and a manufacturing method thereof, including: a substrate; a plurality of transistors, arranged based on a first preset pattern; a plurality of transistor contact structures, corresponding to the transistors, the bottom portions of the transistor contact structures are arranged based on the first preset pattern, and top portions of which are arranged based on the shape of a regular hexagon; a plurality of memory cells, corresponding to the transistor contact structures, the memory cells are arranged based on the shape of a regular hexagon; and a plurality of memory contact structures, corresponding to the memory cells, the bottom portions of the memory contact structures are arranged based on the shape of a regular hexagon, top portions of which are arranged based on a second preset pattern, and the second preset pattern is different from the first preset pattern.