High-Frequency Matching Circuit Layout for Compact Multi-Band Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing high-frequency modules are not adequately miniaturized, and there is a need for improved impedance matching circuits to support multiple frequency bands in communication devices.
Innovation Solution
A high-frequency module design incorporating a mounting substrate with a conductor pattern configuration that includes a main line and a sub-line intersecting the substrate thickness direction, connected to a ground layer and an IC chip for impedance adjustment, allowing for miniaturization and efficient frequency band support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional matching circuits are used for each frequency band, then frequency band coverage is improved, but device size increases
Solution Approach 1:
The patent combines multiple matching circuits for different frequency bands into a single integrated matching circuit structure. The main line and sub-line are configured to provide impedance matching across multiple frequency bands (e.g., 700 MHz, 1.5 GHz, 2.1 GHz, 3.5 GHz) simultaneously, eliminating the need for separate matching circuits for each band and thereby reducing overall device size while maintaining multi-band compatibility
Solution Approach 2:
The matching circuit is designed with universal functionality to operate across multiple frequency bands. By using a single matching circuit structure with adjustable parameters (through switch configurations and variable capacitors/inductors), the circuit can adapt to different frequency requirements, making one component serve multiple functions that previously required separate dedicated circuits
2Reliability
If multiple separate matching circuits are provided for different frequency bands, then impedance matching performance is improved, but circuit complexity increases
Solution Approach 1:
The matching circuit incorporates dynamic adjustment capabilities through switches (e.g., SPDT switches) and variable reactive elements (variable capacitors or inductors) that can be controlled to optimize impedance matching for different frequency bands. This dynamic reconfiguration allows a single circuit to adapt its characteristics to maintain optimal matching performance across multiple bands without requiring multiple fixed matching circuits
Solution Approach 2:
The circuit employs parameter changes in the form of switchable configurations and variable reactive components. By changing the state of switches and adjusting the values of capacitors or inductors, the matching circuit can modify its electrical parameters to achieve optimal impedance matching for different frequency bands, maintaining high performance while using a unified circuit structure
Data Source
AI summary
To achieve miniaturization. A matching circuit is connected to a connection terminal that is one of an input terminal and an output terminal of an amplifier. A mounting substrate has a ground layer. The matching circuit includes a main line, a sub-line, and an IC chip. The main line is formed of a first conductor pattern intersecting a thickness direction of the mounting substrate, and is connected to a connection terminal of the amplifier. The sub-line is formed of a second conductor pattern intersecting the thickness direction of the mounting substrate, and is connected between the main line and the ground layer. The sub-line is opposed to the main line in the thickness direction of the mounting substrate. The IC chip is disposed on the mounting substrate, and includes an adjustment unit that adjusts impedance conversion characteristics of the matching circuit.