Hierarchical Nested Channels for Thermal Interface Particle Control
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Solution Overview
Problem
Modern electronic circuits and components face challenges in achieving low thermal resistance interfaces with heat sinks due to limitations in existing thermal interface materials, particularly in managing high power densities and localized heat flux zones.
Innovation Solution
The development of one-dimensional hierarchical nested channel designs for continuous feed manufacturing processes, which involve forming hierarchical channels on surfaces to control particle stacking and reduce assembly pressure, allowing for efficient heat management and particle distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If particle-filled adhesives or greases are used for thermal interfaces, then thermal resistance is reduced, but interface aging and voiding occur during thermal cycling
Solution Approach 1:
The interface is segmented into multiple hierarchical channels of different sizes (first, second, and third channels) that distribute particles to specific regions. This segmentation prevents uniform particle accumulation and reduces voiding during thermal cycling, while maintaining low thermal resistance through optimized particle placement in critical heat flux zones.
Solution Approach 2:
Different regions of the interface are given different particle concentrations and channel configurations based on local heat flux requirements. High heat flux zones receive higher particle concentrations through targeted channel designs, while other regions have adjusted particle distributions. This local optimization reduces interface aging by preventing uniform stress distribution that leads to voiding.
2Manufacturing precision
If hierarchical channels are formed to control particle stacking, then particle distribution is improved, but manufacturing complexity increases
Solution Approach 1:
The channel structure implements a nested hierarchy where smaller second channels are positioned within regions defined by larger first channels, and third channels are nested within second channels. This nesting approach enables precise particle stacking control through multiple hierarchical levels while maintaining a systematic manufacturing process that can be implemented using standard semiconductor fabrication techniques.
3Temperature
If channels are designed to accommodate localized high heat flux zones, then thermal management is improved, but assembly pressure increases
Solution Approach 1:
The channel design provides partial particle accumulation in specific regions rather than uniform distribution. The hierarchical channels create controlled particle stacking in high heat flux zones while leaving other regions with moderate particle concentrations. This partial action approach manages localized heat flux effectively while distributing assembly pressure more evenly across the interface, preventing excessive pressure concentration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management by reducing interface aging, voiding, and pressure drop during thermal cycling, while maintaining a high solid fill factor and minimizing temperature drops, thus improving the performance of thermal interfaces in electronic components.
Implementation Method 1
a layer of particle-filled viscous material between the first member surface and a second member surface of the second member
Implementation Method 2
The interface between an electronic circuit or component, and a heat sink, should exhibit low thermal resistance so that heat can be conducted away from the circuit or component
Data Source
AI summary
A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface and a second member surface of the second member. An inventive assembly includes mating surfaces with at least one surface formed with a series of parallel hierarchical channels configured to control stacking of the particles during pressing together of the surfaces. The surface is substantially free of any other hierarchical channels formed thereon.