Hierarchical NoC Multi-Instancing for Scalable Backend Closure

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Solution Overview

Problem

Existing NoC designs are limited to flat topologies, preventing a bottom-up approach that could reduce complexity and overheads in chip backend processes, and lack scalability and resource utilization due to inflexible interconnect architectures.

Innovation Solution

Construct NoCs using a hierarchical topology composed of sub-NoCs and leaf components, allowing multi-instancing and incorporating chipset awareness to create adaptable communication infrastructures through algorithmic elaboration and connectivity definitions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If flat topology is used for NoC design, then implementation is straightforward, but scalability and resource utilization are limited

Engineering Contradiction:
ImprovescalabilityVSAvoidtopology complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent divides the NoC into hierarchical segments: root nodes representing sub-NoCs and leaf nodes representing components or sub-NoCs. This segmentation allows the system to scale by adding more leaf nodes without fundamentally changing the overall topology structure, thereby improving scalability while maintaining manageable complexity through modular organization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a hierarchical dimension to the traditional flat NoC topology. By organizing nodes into multiple levels (root nodes and leaf nodes) with defined connectivity rules, the system adds a vertical dimension to the horizontal network structure, enabling scalable expansion while preserving routing simplicity through algorithmic elaboration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If multi-instancing is implemented, then resource utilization improves, but design and verification complexity increases

Engineering Contradiction:
Improveresource utilizationVSAvoiddesign complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent enables multi-instancing by allowing leaf nodes to represent multiple instances of the same sub-NoC or component. Instead of designing each instance separately, the same design can be instantiated multiple times in the hierarchical topology, improving resource utilization while reducing design complexity through reuse. The algorithmic elaboration process automatically handles the multiplication and connectivity of these instances.

Inventive Principle:
Principle #26Copying

3Ease of manufacture

If bottom-up approach is adopted, then complexity in backend processes reduces, but traditional flat topology limitations persist

Engineering Contradiction:
Improvebackend process complexityVSAvoidtopology flexibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies bottom-up design by allowing sub-NoCs to be designed, validated, and elaborated independently before being instantiated as root nodes in the hierarchical topology. This preliminary action on smaller units reduces backend process complexity because each sub-NoC can be optimized and verified separately. The hierarchical structure then combines these pre-elaborated units, maintaining topology flexibility through the algorithmic generation of interconnections.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20260012422A1Network on chip construction through multi-instancing
Publication Date: 2026.01.08 BAYA SYSTEMS INC
  • US20260012422A1 patent drawing
  • US20260012422A1 patent drawing
  • US20260012422A1 patent drawing

AI summary

Apparatus and methods for constructing Network on Chips (NoCs) by algorithmically elaborating one or more of Network on Chips (NoCs) through a hierarchical topology composed of instantiations of sub-NoCs and leaf components, and one or more connectivity definitions. Designing NoCs using one or more instantiations of sub-NoCs reduces overheads during chip backend processes, such as for timing closure.