High-Frequency Circuit Board Coating Structure
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Solution Overview
Problem
Conventional high-frequency circuit boards, particularly those using polyimide substrates, face challenges with high-frequency transmission loss, moisture absorption, and poor structural reliability, making them unsuitable for the increasing demands of 5G technology products.
Innovation Solution
A method for coating and forming a novel material layer structure on high-frequency circuit boards using synthetic liquid films and high-frequency materials, involving multiple heating and roasting zones in a tunnel oven, followed by hot pressing, to create a structure with improved signal transmission and reduced power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyimide substrate is used for soft board, then the soft board can be manufactured with conventional processes, but the high-frequency transmission loss is serious and moisture absorption is high
Solution Approach 1:
The patent uses PTFE (polytetrafluoroethylene) material instead of conventional polyimide substrate to create a composite structure with copper foil and adhesive layers. PTFE provides excellent high-frequency transmission characteristics, low moisture absorption, and low dielectric loss, resolving the contradiction between transmission performance and manufacturing ease by selecting a material that inherently possesses both required properties.
Solution Approach 2:
The patent changes the substrate material parameter from polyimide to PTFE, which fundamentally alters the electrical and physical properties. This parameter change achieves low dielectric constant, low loss factor, and low moisture absorption, thereby improving high-frequency transmission performance while maintaining manufacturability through established lamination processes.
2Reliability
If multi-layer structure is adopted to improve performance, then signal transmission quality improves, but process flow becomes more complex and manufacturing cost increases
Solution Approach 1:
The patent combines the substrate, adhesive, and copper foil into an integrated multi-layer structure where PTFE substrate provides both mechanical support and optimal electrical properties. The adhesive layer is specifically formulated to bond copper foil to PTFE while maintaining high-frequency performance. This merging approach achieves excellent signal transmission quality without requiring excessive process complexity by optimizing each layer's function.
Solution Approach 2:
The patent applies different materials with specific properties to different layers: PTFE for low-loss signal transmission, specialized adhesive for strong bonding with low dielectric impact, and copper foil for conduction. Each layer is optimized for its specific function, achieving high overall performance while keeping the structure manageable and the process flow reasonable.
3Strength
If conventional PI film and epoxy adhesive are used for cover layer, then protection and isolation are provided, but the structural characteristics are poor and high-frequency transmission loss increases
Solution Approach 1:
The patent replaces conventional epoxy adhesive with PTFE-based adhesive material in the cover layer. This composite approach maintains the protective and isolating functions while dramatically reducing dielectric loss and moisture absorption. The PTFE adhesive provides both mechanical bonding strength and excellent high-frequency electrical properties, resolving the contradiction between protection function and energy loss.
Solution Approach 2:
The patent changes the adhesive material parameter from epoxy to PTFE-based adhesive, which alters the dielectric properties of the cover layer. This parameter change reduces the loss factor and dielectric constant, thereby reducing high-frequency transmission loss while maintaining adequate protective strength through the adhesive's bonding properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel material layer structure enables high-speed transmission of high-frequency signals with low power consumption, simplifies manufacturing, reduces production costs, and adapts to the current high-frequency and high-speed trends in wireless networks, specifically benefiting 5G technology products.
Implementation Method 1
delivering the copper foil coated with the synthetic liquid film into a tunnel oven, and successively passing the same through a plurality of sections of heating and roasting zones in the tunnel oven at a speed of 0.5-20 m/s for roasting in sections
Implementation Method 2
so as to form a cured film on the copper foil
Implementation Method 3
delivering the single-sided board coated with the synthetic liquid high-frequency material layer to the tunnel oven, and successively passing the same through a plurality of sections of heating and roasting zones in the tunnel oven at a speed of 0.5-20 m/s for roasting in sections
Implementation Method 4
until the synthetic liquid high-frequency material layer on the single-sided board becomes a semi-cured high-frequency material layer
Implementation Method 5
followed by hot pressing, to create a structure with improved signal transmission
Data Source
AI summary
The present invention discloses a method for coating and forming a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid film on a copper foil; (2) delivering the same to a tunnel oven for roasting, and forming a cured film on the copper foil to obtain a single-sided board; (3) coating a layer of synthetic liquid high-frequency material on the cured film; and (4) delivering the same to the tunnel oven for roasting until the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer so as to obtain a novel material layer structure of a high-frequency circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to make a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to circuit board preparation and simplifies the process.