High Frequency Inductor Chip Single-Piece Core
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Solution Overview
Problem
Existing high frequency inductor chip manufacturing methods are complex and prone to insufficient bonding strength and non-ohmic contact issues due to multi-layered structures, which complicate the process and lead to undesired Joule heating.
Innovation Solution
A high frequency inductor chip with a single-piece non-magnetic core and a coil deposited using deposition techniques, formed through a simplified method involving patterned photoresist layers, seed layers, and metal deposition, allowing for a reduced step process and improved mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a multilayered structure is used to form the inductor, then the manufacturing process can be simplified through lamination, but the bonding strength between layers becomes insufficient and non-ohmic contact issues arise
Solution Approach 1:
The patent merges multiple circuit plates into a single integrated structure where the coil pattern is formed continuously across what would otherwise be separate layers. This eliminates the interfaces between layers, removing the bonding strength problem while maintaining the simplified manufacturing approach of forming patterns on a substrate.
2Device complexity
If multiple circuit plates are laminated together, then the inductor structure can be formed, but the number of manufacturing steps increases significantly
Solution Approach 1:
The patent extracts the essential function of multiple laminated plates and implements it through a single plate with a continuous coil pattern. By taking out the lamination step and replacing it with a single-pattern formation process, the manufacturing step count is reduced from at least 13 steps to a simplified process while maintaining the inductor's structural complexity.
3Manufacturing precision
If numerous manufacturing steps including punching, filling, and sintering are performed, then the circuit plates can be formed, but the production time and complexity increase
Solution Approach 1:
The patent replaces the mechanical punching and filling process with a deposition-based pattern formation method. Instead of mechanically creating holes and filling them with conductive material, the coil pattern is directly formed through deposition techniques, eliminating multiple sequential steps and reducing production time while maintaining manufacturing precision.
4Device complexity
If interfaces between adjacent circuit patterns are created, then multiple plates can be connected, but undesired Joule heating occurs at the interfaces
Solution Approach 1:
The patent merges adjacent circuit patterns into a continuous conductive path on a single plate, eliminating the interfaces between patterns. This removes the source of Joule heating at interfaces while maintaining the electrical connection function that would otherwise require multiple plated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, enhances mechanical strength, and eliminates non-ohmic contact issues, resulting in a more reliable and efficient high frequency inductor chip.
Implementation Method 1
forming a seed layer on each of the chip bodies of the patterned wafer, such that the seed layer is disposed on and around each of the chip bodies
Implementation Method 2
depositing a metal on the exposed region of the seed layer so as to form a coil on and around each of the chip bodies of the patterned wafer through deposition techniques
Data Source
AI summary
A high frequency inductor chip includes a core and a coil. The core is in the form of a single piece of a non-magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. A method for making the high frequency inductor chip is also disclosed.