High Frequency Module Ground Slits for Signal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Signal interference occurs not only between voltage supply lines but also between paths for reception signals in high frequency modules with IC chips that include low noise amplifiers.
Innovation Solution
A high frequency module with a multilayer mounting substrate featuring a first and second ground layer, via conductor groups, and slits between via conductors to reduce signal interference by improving isolation between switches and low noise amplifiers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If voltage supply lines are arranged closely to reduce area, then area is reduced, but signal interference between voltage supply lines increases
Solution Approach 1:
The ground layer is segmented into multiple independent ground patterns (first ground pattern, second ground pattern, third ground pattern) that are spatially separated by slits. This segmentation isolates the voltage supply lines and signal paths, preventing interference while maintaining compact layout.
Solution Approach 2:
Ground patterns serve as intermediary shielding structures between voltage supply lines and signal paths. The ground patterns, connected to ground potential, act as electromagnetic shields that block interference between adjacent circuits, allowing close spacing without compromising signal integrity.
2Area of stationary object
If reception signal paths are arranged closely to reduce area, then area is reduced, but signal interference between reception signal paths increases
Solution Approach 1:
The ground layer is divided into multiple independent ground patterns separated by slits, creating isolated ground regions for different reception signal paths. This segmentation prevents electromagnetic coupling between adjacent signal paths while maintaining compact substrate area.
3Reliability
If ground layer is made continuous to improve grounding, then grounding quality is improved, but signal leakage between adjacent circuits increases
Solution Approach 1:
The continuous ground layer is segmented into multiple independent ground patterns (first, second, and third ground patterns) separated by slits. Each ground pattern provides local grounding for specific circuits while the slits prevent signal leakage between adjacent circuits, achieving both good grounding and isolation.
Solution Approach 2:
Different ground patterns are strategically positioned to provide local grounding quality for specific circuits. The first ground pattern serves voltage supply lines, the second ground pattern serves reception signal paths, and the third ground pattern provides additional shielding, with each having optimized local grounding properties for its specific function.
Data Source
AI summary
A high frequency module includes a mounting substrate and an IC chip. The IC chip includes a plurality of switches and a plurality of low noise amplifiers. The mounting substrate includes a first ground layer, a second ground layer, a first via conductor group, and a second via conductor group. The first ground layer has a plurality of slits. The plurality of slits include a first slit and a second slit. The first slit is arranged between a first via conductor and a third via conductor in a plan view from a thickness direction of a mounting substrate. The second slit is arranged between a second via conductor and a fourth via conductor in a plan view from the thickness direction of the mounting substrate.