High-frequency module laminated component wiring design
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Solution Overview
Problem
Existing high-frequency modules face challenges in miniaturization due to the large space required for plated-through holes for electrical connections, limiting their downsizing potential.
Innovation Solution
A high-frequency module design featuring a substrate with laminated components where connection terminals on one surface are connected via wiring to terminals on an opposing surface, reducing the need for dedicated terminals and minimizing the overall module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plated-through holes are used for electrical connection to the second functional structure, then electrical connection is achieved, but the device size increases due to the space required for the plated-through holes
Solution Approach 1:
The patent transitions from planar electrical connections (requiring plated-through holes in the same layer) to three-dimensional connections by providing wiring on the back surface of the first functional structure. This allows vertical stacking of components while maintaining electrical connectivity, effectively utilizing the Z-dimension to reduce the device's footprint area.
Solution Approach 2:
The patent implements a nested configuration where the second functional structure is disposed on the back surface of the first functional structure, and wiring is embedded within the back surface to connect to terminals of the first functional structure. This nested arrangement allows multiple functional structures to be stacked vertically, reducing the overall device size while maintaining all necessary electrical connections.
2Adaptability or versatility
If the number of terminals for electrical connection is increased, then connection flexibility is improved, but the space required for plated-through holes increases
Solution Approach 1:
By moving wiring to the back surface of the first functional structure, the patent creates additional connection points in the vertical dimension. This allows multiple terminals to be connected without increasing the planar area, as connections are distributed across multiple layers (front surface, back surface, and intermediate wiring layers) rather than competing for the same two-dimensional space.
Solution Approach 2:
The patent segments the electrical connection function across multiple surfaces and layers: terminals on the front surface, wiring on the back surface, and terminals on the second functional structure. This segmentation allows connection flexibility to be distributed across different spatial zones, reducing the concentration of connection requirements in any single area.
Data Source
AI summary
A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.