High-Frequency Module Terminal Assemblies for Stress Distribution
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Solution Overview
Problem
High-frequency modules face connection reliability issues due to stress on terminal electrodes in corner portions of the substrate during mounting, leading to potential damage and increased manufacturing costs when attempting to enhance connection strength by varying terminal electrode sizes.
Innovation Solution
The implementation of terminal assemblies with differently sized and spaced connection conductors, where larger conductors are placed in stress-prone corner areas and smaller conductors elsewhere, both integrated within resin blocks with low dielectric loss tangent for reduced stray capacitance and signal loss, and covered by sealing resin layers to enhance bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the size of terminal electrodes in corner portions is increased to enhance connection strength, then bonding reliability is improved, but the number of manufacturing steps and costs increase
Solution Approach 1:
The patent applies local quality by providing terminal electrodes with different sizes at different locations: corner portions have larger terminal electrodes for enhanced stress resistance, while non-corner portions have smaller terminal electrodes. This localized differentiation improves bonding reliability where needed without unnecessarily increasing manufacturing complexity across the entire substrate.
Solution Approach 2:
The terminal electrode structure is segmented into different size categories based on location. The patent divides terminal electrodes into first terminal electrodes (larger size) for corner portions and second terminal electrodes (smaller size) for non-corner portions, allowing each segment to be optimized for its specific functional requirements while simplifying the overall manufacturing process.
2Strength
If terminal electrodes in corner portions are made larger to resist stress, then connection strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent implements local quality by making terminal electrodes in corner portions larger to resist stress while keeping terminal electrodes in non-corner portions smaller. This localized approach ensures connection strength is improved only where stress resistance is critical, rather than uniformly increasing the size of all terminal electrodes, thereby controlling manufacturing costs.
Solution Approach 2:
The patent applies partial action by providing larger terminal electrodes only in corner portions where stress resistance is needed, rather than making all terminal electrodes large. This partial differentiation achieves the necessary connection strength improvement while avoiding excessive manufacturing costs that would result from uniformly enlarging all terminal electrodes across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases connection reliability by distributing stress and reducing signal loss, while maintaining cost-effectiveness by minimizing the number of manufacturing steps and using cost-effective resin materials.
Implementation Method 1
a resin block 6b made of a liquid crystal polymer resin having a dielectric loss tangent lower than that of an epoxy resin
Data Source
AI summary
A high-frequency module (1) includes a component (3a) mounted on an upper surface (2a) of a substrate (2), a second sealing resin layer (4) stacked on the upper surface (2a) of the substrate (2), a component (3b) mounted on a lower surface (2b) of the substrate (2), a first sealing resin layer (5) stacked on the lower surface (2b) of the substrate (2), and a first terminal assembly (6) and a second terminal assembly (7) that are mounted on the lower surface (2b) of the substrate (2). The first terminal assembly (6) is mounted on a four-corner portion of the substrate (2) and includes a connection conductor (6a) thicker than a connection conductor (7a) of the second terminal assembly (7).