High Modulus Adhesive Layer for Flexible Display Impact Resistance
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Solution Overview
Problem
Flexible active matrix display substrates face challenges with reduced impact endurability and bonding failures between driver circuit boards and flexible circuit boards due to the use of Polyimide films, which compromise the structural integrity and reliability of the display devices.
Innovation Solution
Incorporating a high Young's modulus adhesive layer between the active component array and the support layer in the display device, with specific adhesive layers having moduli greater than 10 GPa to enhance impact resistance and a second adhesive layer with lower modulus for flexibility, while maintaining bonding stability through strategically placed adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If Polyimide film is used as flexible substrate to replace glass substrate, then flexibility is improved, but impact endurability deteriorates
Solution Approach 1:
The patent uses a composite structure combining flexible Polyimide substrate with a rigid support layer (glass or metal) and high Young's modulus adhesive layers. This composite construction allows the display to maintain flexibility from the PI substrate while gaining impact resistance from the support layer and stiff adhesive, resolving the contradiction between flexibility and impact endurability.
Solution Approach 2:
The patent applies different adhesive layers with different Young's modulus values at different locations between the active component array layer and support layer. Specifically, a first adhesive layer with high Young's modulus (>10 GPa) is used in impact-prone areas to enhance impact resistance, while a second adhesive layer with lower Young's modulus is used in flexibility-required areas, allowing local optimization of both flexibility and impact endurability.
2Adaptability or versatility
If flexible substrate is used, then flexibility is improved, but bonding reliability deteriorates
Solution Approach 1:
The patent employs adhesive layers with spatially varying Young's modulus properties. The first adhesive layer with high Young's modulus is positioned in regions where bonding reliability is critical, providing strong mechanical coupling between the active component array layer and support layer. The second adhesive layer with lower Young's modulus is positioned where flexibility is needed, preventing bonding failure while maintaining adaptability.
3Strength
If high Young's modulus adhesive layer is used, then impact endurability is improved, but flexibility deteriorates
Solution Approach 1:
The patent strategically positions adhesive layers with different Young's modulus values within the display structure. The first adhesive layer with high Young's modulus (>10 GPa) is applied in specific regions to enhance impact endurability, while the second adhesive layer with lower Young's modulus is applied in other regions to preserve flexibility. This localized differentiation allows the overall structure to achieve both high impact resistance and maintained flexibility.
Solution Approach 2:
The patent creates a composite adhesive system combining materials with different mechanical properties. By integrating a high-stiffness adhesive layer with a low-stiffness adhesive layer in a multi-layer configuration, the system achieves composite behavior that simultaneously provides impact protection and flexibility, resolving the contradiction between these two opposing requirements.
Data Source
AI summary
A display device includes a display medium layer, an active component array layer, a support layer, and a first adhesive layer. The display medium layer has a light-emitting surface. The active component array layer is disposed on a side of the display medium layer away from the light-emitting surface. The support layer is disposed on a side of the active component array layer away from the display medium layer. The first adhesive layer is connected between the active component array layer and the support layer, in which the active component array layer is directly connected to the first adhesive layer. The first adhesive layer has a Young's modulus greater than 10 GPa.