High Resistivity Ceramic Packaging for Electric Field Sensors
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Solution Overview
Problem
Micro electric field sensors are susceptible to environmental factors such as dust, airflow, rain, and high humidity, which affect their operation due to their small size and weak signal, leading to challenges in packaging that ensure effective shielding and protection.
Innovation Solution
A packaging element for electric field sensors using high resistivity materials (≥108Ω·cm) for the substrate, packaging frame, and packaging cover to form an enclosed cavity that houses the sensor chip, enhancing environmental adaptability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pure metal sealing cap is used for packaging, then the sensor is protected from environmental factors, but the electric field is shielded due to the metal cabin formed by metal and substrate
Solution Approach 1:
The patent employs a composite packaging structure combining high-resistivity ceramic material with metal components. The ceramic substrate and packaging cover form a non-conductive enclosure that protects the sensor from environmental factors while avoiding the electric field shielding effect of pure metal structures. This composite approach resolves the contradiction by integrating the protective advantages of metal with the electric field transparency of ceramic materials.
Solution Approach 2:
The patent changes the electrical resistivity parameter of the packaging material from conductive (metal) to high-resistivity (ceramic with resistivity ≥108Ω·cm). This parameter change allows the packaging structure to simultaneously provide environmental protection and maintain electric field accessibility to the sensor, eliminating the shielding effect while preserving protective functions.
2Measurement precision
If a hole is arranged in the upper surface of a metal cover for packaging, then the electric field can access the sensor, but it is difficult to achieve effective packaging due to failing to block humidity and dust
Solution Approach 1:
The patent uses high-resistivity ceramic material as the primary packaging structure, which inherently provides both electric field transparency and environmental sealing. The ceramic packaging cover forms a complete enclosure that blocks humidity and dust ingress while allowing electric field access, eliminating the need for holes in metal covers and achieving both measurement accuracy and environmental protection simultaneously.
Solution Approach 2:
The patent applies high-resistivity ceramic material specifically to the packaging cover and substrate components that interface with the electric field, while using metal components for structural support and mechanical protection. This localized application of different material properties optimizes both electric field access and environmental protection functions.
3Reliability
If micro electric field sensor packaging is improved to block humidity and dust, then environmental adaptability increases, but the structure becomes more complex
Solution Approach 1:
The high-resistivity ceramic packaging structure serves multiple functions simultaneously: it provides environmental sealing against humidity and dust, maintains electric field accessibility to the sensor, offers mechanical protection, and eliminates the need for additional sealing components or complex multi-layer structures. This multi-functionality reduces overall device complexity while achieving high environmental adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The high resistivity material-based packaging element ensures accurate electric field measurement and improves the stability and reliability of electric field detection by shielding environmental influences, allowing for effective operation in various conditions.
Implementation Method 1
at least one of the substrate, the first packaging frame, and the first packaging cover is of a high resistivity material having an electrical resistivity equal to or greater than 108Ω·cm
Data Source
AI summary
A high resistivity material-based packaging element for an electric field sensor comprises: a substrate; a first packaging frame fixed to the substrate; and a first packaging cover fixed to the packaging frame; wherein at least one electric field sensor chip is located in an inner cavity formed by the substrate, the first packaging frame, and the first packaging cover, and at least one of the substrate, the first packaging frame, and the first packaging cover is of a high resistivity material having an electrical resistivity equal to or greater than 108Ω·cm. The present invention can ensure accurate measurement of the electric field, and provide an approach to solve the problem of environmental adaptability, thereby enhancing the stability and reliability of electric field detection.