High-Voltage Probe Head with Segmented Gas Channels for Arc Prevention
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Solution Overview
Problem
Current prober technologies are unable to perform parallel testing of high voltage semiconductor components on a wafer without causing arcing or leaving components untested, especially those at the edge, due to the mismatch between the circular wafer and rectangular test equipment, leading to inefficiencies and additional costs.
Innovation Solution
A probe head with multiple test sites, each equipped with a group of contact elements and a dedicated gas supply channel, and adjustable flow resistance to maintain pressurized gas, preventing arcing and ensuring all components are tested efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressurized gas is supplied to all test sites in a rectangular pressurized chamber, then high voltage components can be tested without arcing, but components at the edge of the circular wafer cannot be tested due to geometric mismatch
Solution Approach 1:
The patent divides the pressurized gas supply system into separate gas supply channels for each test site. This segmentation allows independent pressure control at each test site, enabling the pressurized chamber to adapt to the circular wafer geometry and test edge components without compromising arc prevention at other sites.
Solution Approach 2:
The patent implements local pressure control by providing individual gas supply channels to each test site. This allows different pressure conditions to be applied locally at each test site according to its specific requirements, particularly enabling edge test sites on the circular wafer to maintain proper pressurization for high voltage testing.
2Productivity
If parallel testing is performed on all components at once, then productivity increases, but arcing occurs between contact elements due to insufficient gas pressure control
Solution Approach 1:
The patent segments the gas supply system into individual channels for each test site, enabling independent pressure regulation during parallel testing. This ensures that each group of contact elements maintains sufficient gas pressure to prevent arcing, even when multiple high voltage components are tested simultaneously across the wafer.
Solution Approach 2:
The patent changes the pressure parameter locally at each test site through separate gas supply channels. By adjusting pressure independently at each location, the system maintains arc-preventing conditions across all parallel test sites simultaneously, enabling reliable high voltage parallel testing.
3Reliability
If testing is performed after packaging, then component reliability is ensured, but additional packaging cost and time are incurred for failed components
Solution Approach 1:
The patent performs wafer-level testing before packaging using the pressurized probe head system. This preliminary action identifies failed components early, allowing them to be discarded without packaging. Only passing components undergo packaging, eliminating waste of packaging materials and reducing costs for failed components.
Solution Approach 2:
The system enables self-testing of semiconductor components on the wafer before packaging. By integrating the pressurized test environment directly into the wafer processing flow, components can be tested in their current state without requiring packaging, and failures are identified before any packaging resources are committed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective parallel testing of high voltage components on a wafer by minimizing arcing and ensuring all components are tested, reducing double testing and waste.
Implementation Method 1
High voltage components are often tested under pressurized gas or air, according to Paschen's Law, so that arcing may be avoided.
Data Source
Figure 1A~1C
Figure 2A~2B
Figure 3A~3B
AI summary
A probe head for parallel testing a plurality of electronic components on a wafer, in particular for parallel testing high voltage semiconductor components, comprises: - an arrangement of a plurality of test sites wherein each test site is adapted to test a different electronic component, - a plurality of groups of contact elements, wherein each group of contact elements is assigned to a different one of the test sites and is adapted to contact to the respective electronic component, and wherein the probe head further comprises:- a plurality of gas supply channels wherein each gas supply channel passes through a different test site of the plurality of test sites and supplies separately pressurized gas to the assigned group of contact elements. A probe card and a method of using the probe head are provided.