High-Voltage Probe Head Segmentation for Parallel Wafer Testing
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Solution Overview
Problem
Existing semiconductor component testing methods, particularly for high voltage components, are inefficient and costly due to duplicate testing and untested components, and rectangular testing equipment limits parallel testing on circular wafers.
Innovation Solution
A probe head with multiple test sites, contact elements, and gas supply channels that supply separately pressurized gas to each site, allowing for parallel testing of high voltage components on a wafer while preventing arcing, using adjustable flow resistance and throttle valves to maintain pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rectangular testing equipment is used for high voltage components, then arcing is prevented through pressurized gas chambers, but parallel testing of electronic components on circular wafers is limited
Solution Approach 1:
The probe card is divided into multiple independent test sites (first test site, second test site, etc.), each with its own gas supply channel and contact elements. This segmentation allows different regions to be independently pressurized and tested in parallel, resolving the contradiction between arcing prevention and parallel testing capability
Solution Approach 2:
The invention transitions from a single rectangular pressurized chamber to a multi-dimensional array of test sites arranged to match the circular wafer geometry. Test sites are positioned at different locations (including edge positions) to enable parallel testing across the entire wafer surface while maintaining local pressurization for arcing prevention
2Reliability
If separate gas supply channels are provided for each test site, then pressure consistency is maintained across all sites, but device complexity increases
Solution Approach 1:
Each test site is equipped with a dedicated gas supply channel that can be independently controlled and pressurized. This segmentation ensures that pressure consistency is maintained at each test site without being affected by variations at other sites, resolving the contradiction between pressure consistency and device complexity
Solution Approach 2:
The gas supply system uses a universal pressurized gas source that is distributed to multiple test sites through separate channels. This multi-functional approach allows a single gas supply system to serve multiple purposes (pressurizing multiple test sites) while maintaining independent control, balancing reliability and complexity
3Productivity
If parallel testing is implemented across the entire wafer, then duplicate testing is reduced, but untested components at wafer edges are eliminated
Solution Approach 1:
The test sites are arranged in a circular pattern that matches the wafer geometry, extending to the edge positions. This dimensional arrangement ensures that all electronic components across the entire wafer surface (including edges) can be tested in parallel, eliminating both duplicate testing and untested components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient parallel testing of high voltage components on a wafer, reducing duplicate testing and arcing, and maintaining consistent pressure across all test sites.
Implementation Method 1
High voltage components are often tested under pressurized gas or air, according to Paschen's Law, so that arcing may be avoided.
Implementation Method 2
a plurality of gas supply channels, each gas supply channel passing through a different test site of the plurality of test sites and supplying separately pressurized gas to the assigned group of contact elements
Data Source
AI summary
A probe head may include a plurality of test sites, each configured to test a different one of the electronic components. A probe head may include a plurality of groups of contact elements, each associated with a different test site and configured to contact a respective electronic component to be tested in the different test site. A probe head may include a plurality of gas supply channels, each passing through a respective test site and configured to supply pressurized gas to a respective group of contact elements associated with the respective test site.