High-Voltage Resistor Structure With Insulator Element Shielding

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Solution Overview

Problem

High voltage resistor structures and voltage divider arrangements face challenges in manufacturing, reliability, and safety due to excessive electric stresses, which can lead to dielectric failures such as partial discharge or electrical breakdown.

Innovation Solution

The proposed solution involves a resistor structure comprising an electrically insulating substrate, conductive terminals, and a resistive path with an insulator element applied adjacent to the resistive path. The insulator element's thickness is at least 30% of the resistive trace's thickness when the trace is uncoated, or the total thickness of the insulator element and coating exceeds the coating thickness on the resistive trace by at least 30% when the trace is coated.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the resistive path is exposed without sufficient insulation, then the manufacturing process is simpler, but the reliability decreases due to dielectric failures under high electric field intensity

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

An insulator element is introduced as an intermediary component between the resistive path and the surrounding environment. This insulator element provides the necessary electrical insulation to prevent dielectric failures under high electric field intensity, thereby improving reliability without requiring fundamental changes to the manufacturing process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulator element is implemented as a thin film or coating applied directly to the substrate adjacent to the resistive path. This approach provides effective insulation while maintaining a compact structure and minimizing impact on manufacturing complexity

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If the insulator element thickness is increased to protect against electric stresses, then the reliability improves, but the manufacturing precision requirements increase

Engineering Contradiction:
ImprovereliabilityVSAvoidmanufacturing precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent specifies a quantitative parameter for the insulator element thickness: at least 30% of the resistive trace thickness when uncoated, or the total thickness of insulator element and coating exceeds the coating thickness on the resistive trace by at least 30% when coated. This parameter-based approach provides clear manufacturing guidelines while ensuring sufficient insulation for reliability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The insulator element is applied during the manufacturing process before final assembly and testing. This preliminary application of insulation ensures that the protective function is built into the structure from the outset, allowing for quality control at the manufacturing stage rather than requiring post-manufacturing adjustments

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250157701A1Resistor Structure and a Voltage Divider Arrangement
Publication Date: 2025.05.15 ABB (SCHWEIZ) AG
  • US20250157701A1 patent drawing
  • US20250157701A1 patent drawing
  • US20250157701A1 patent drawing

AI summary

A resistor structure includes at least an electrically insulating substrate, at least one electrically conductive terminal directly or indirectly provided on the substrate, at least one resistive path comprising at least one resistive trace directly or indirectly provided on the substrate and directly or indirectly joined to the terminal, wherein a thickness of the resistive trace is the thickness of the resistive trace in the thickness direction facing away from the substrate, characterized in that at least one insulator element is applied directly or indirectly and at least partially on the substrate, wherein a thickness of the insulator element is the thickness of the insulator element in the thickness direction facing away from the substrate.