High-frequency Module Wiring Separation for Noise Reduction
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Solution Overview
Problem
High-frequency switch control signals generate harmonic noise that interferes with high-frequency signals in multilayer substrate-based modules, leading to degradation in communication characteristics such as reduced reception sensitivity and transmission signal distortion.
Innovation Solution
The high-frequency module design separates control signal wiring conductors from high-frequency signal wiring conductors and matching device ground conductors within the multilayer substrate, using a configuration where control signal wiring is on a dielectric layer close to the second main surface and high-frequency signal wiring is on a dielectric layer close to the first main surface, with additional ground conductors electrically separating these components to prevent electromagnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If control signal wiring and high-frequency signal wiring are placed close together in the multilayer substrate, then the device complexity is reduced and manufacturing is simplified, but harmonic noise from control signals interferes with high-frequency signals degrading communication characteristics
Solution Approach 1:
The patent applies dimensional separation by assigning control signal wiring to one dielectric layer and high-frequency signal wiring to another dielectric layer within the multilayer substrate structure. This vertical layering in the thickness direction creates spatial separation that reduces electromagnetic coupling and harmonic noise interference while maintaining a compact overall device form factor.
Solution Approach 2:
The patent segments the wiring structure by dividing the multilayer substrate into distinct functional layers: control signal wiring conductors on one dielectric layer, high-frequency signal wiring conductors on another dielectric layer, and ground conductors positioned between them. This segmentation isolates different signal types to prevent interference while keeping the system integrated.
2Area of stationary object
If control signal wiring conductor and high-frequency signal wiring conductor are located on the same or adjacent dielectric layers, then the area occupied by wiring is minimized, but electromagnetic coupling occurs causing signal degradation
Solution Approach 1:
The patent resolves the area-quality contradiction by utilizing the thickness direction of the multilayer substrate to separate control signal and high-frequency signal wiring into different dielectric layers. This vertical separation reduces electromagnetic coupling and improves signal quality while maintaining compact horizontal footprint.
Solution Approach 2:
The patent introduces ground conductors as intermediary elements positioned between the control signal wiring conductor and the high-frequency signal wiring conductor. These ground conductors act as electromagnetic shields that block coupling between the two signal types, ensuring signal quality while allowing both wiring types to coexist in close proximity.
3Device complexity
If ground conductor layer is used for both control signal and high-frequency signal reference, then the structure is simplified, but harmonic noise is superimposed on high-frequency signals through the shared ground
Solution Approach 1:
The patent segments the ground conductor system into separate ground conductor layers associated with different signal types. By providing dedicated ground references for control signals and high-frequency signals on different dielectric layers, the patent prevents noise superimposition while maintaining structural organization.
Solution Approach 2:
The patent uses intermediate ground conductors positioned between control signal wiring and high-frequency signal wiring as electromagnetic shields. These intermediary ground layers block the propagation of harmonic noise from control signals to high-frequency signals, preventing noise superimposition while maintaining a structured ground system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the influence of harmonic noise, thereby minimizing the degradation of communication characteristics and preventing signal distortion and sensitivity loss.
Implementation Method 1
harmonic noise due to high-frequency switch control signals is superimposed on the high-frequency signal line of a high-frequency switch through a ground conductor layer within a multilayer substrate
Data Source
AI summary
A multilayer substrate includes therein wiring conductors, ground conductors, interlayer connection conductors, and a matching inductor. A control signal input terminal is provided on a second main surface of the multilayer substrate. Electrodes on which a high-frequency switch is mounted are electrically connected to the wiring conductors through the interlayer connection conductors. The control signal wiring conductor is located on a dielectric layer close to the second main surface of the multilayer substrate, and the high-frequency signal wiring conductor is located on a dielectric layer close to a first main surface of the multilayer substrate. The ground conductor, which is superposed with the control signal wiring conductor in plan view is separated from the matching device conduction ground conductor by a separation portion. With this structure, influence of harmonic noise due to input of high-frequency switch control signals is reduced and degradation of the communication characteristics is reduced.