Hinged Sensor Pixels for Low-Noise Bias and Glass Integration
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Solution Overview
Problem
The challenge lies in manufacturing electronic devices with sensors on a glass substrate while minimizing cost and improving yield, as existing methods face difficulties in aligning the manufacturing processes of sensors and glass substrates, leading to noise in bias voltage accuracy and external force sensitivity due to differences in lithography rules and material compatibility.
Innovation Solution
The solution involves designing electronic devices with hinges that support pixels, where the hinge length is greater than the pixel pitch, allowing for cost-effective manufacturing using larger lithography rules, and incorporating bias voltage generation methods that account for lithography and process variations, using multiple bias-generating pixels to reduce noise and improve accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sensors are manufactured using smaller lithography rules (0.25-0.35 μm) while glass substrate uses larger lithography rules (1.5 μm or larger), then sensor precision is improved, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The device is segmented into two distinct manufacturing domains: sensors manufactured using precise silicon process (0.25-0.35 μm lithography) and interfacing components manufactured using larger lithography rules (1.5 μm or larger). This segmentation allows each component to be optimized for its specific manufacturing process, reducing overall manufacturing cost while maintaining sensor precision.
Solution Approach 2:
Interfacing components serve as intermediaries between the high-precision sensors and the glass substrate. These components bridge the gap between different manufacturing processes, enabling the integration of precision sensors with cost-effective glass substrate manufacturing without requiring the entire device to be manufactured using expensive small-lithography rules.
2Ease of operation
If bias voltage is provided to sensors, then sensor operation is enabled, but noise increases and bias voltage accuracy deteriorates
Solution Approach 1:
A feedback mechanism is implemented where the bias voltage is adjusted based on detected conditions. The system monitors the bias voltage accuracy and electrostatic forces, then dynamically adjusts the bias voltage to compensate for noise and maintain measurement precision during sensor operation.
Solution Approach 2:
The bias voltage parameters are dynamically changed based on operating conditions. The system adjusts voltage magnitude and timing to optimize sensor operation while minimizing noise impact and maintaining accuracy, rather than using a fixed bias voltage throughout operation.
3Ease of operation
If electrostatic forces are applied between sensor nodes, then sensor actuation is achieved, but mechanical stability deteriorates and external force sensitivity increases
Solution Approach 1:
The design incorporates preliminary anti-actions to counteract electrostatic forces before they cause mechanical instability. Structural features are pre-configured to resist electrostatic attraction and repulsion forces, maintaining mechanical stability during sensor actuation while enabling necessary movement for operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances accuracy by minimizing noise and process variations, and improves the mechanical and thermal isolation of pixels, resulting in more reliable electronic devices with improved sensitivity and reduced thermal stress.
Implementation Method 1
a hinge between one of the two pixels and the substrate. The hinge supports the pixel
Implementation Method 2
the sensors may experience electrostatic forces caused by voltages applied (e.g., the bias voltage) between nodes of the sensor
Data Source
AI summary
Electronic devices comprising pixels for sensing, methods for operating the electronic devices, and methods for manufacturing the electronic devices are disclosed. In some embodiments, the electronic devices comprise hinges for supporting the pixels. In some embodiments, the electronic devices are configured to provide a bias voltage to the pixels.