Head-Mounted Display Thermal Conductive Layer Design

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Solution Overview

Problem

Augmented reality (AR) glasses often suffer from local hot spots due to the thermal resistance of uniform temperature materials, leading to surface temperatures exceeding safety regulations.

Innovation Solution

A head-mounted display design that incorporates a thermally conductive material layer connecting the heat source to the case body, with a design that ensures the first distance from the heat source to the case body is greater than the second distance, facilitating uniform heat distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If uniform temperature material is used for heat dissipation, then natural convection heat dissipation is achieved, but local hot spots remain due to thermal resistance

Engineering Contradiction:
Improvesurface temperatureVSAvoidtemperature uniformity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies local quality by varying the thickness of the thermally conductive material layer in different regions. The layer is thicker at locations farther from the heat source and thinner near the heat source, creating non-uniform thermal distribution that compensates for thermal resistance and eliminates local hot spots.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the geometric parameter (thickness) of the thermally conductive material layer to optimize heat dissipation. By adjusting the thickness parameter across different regions, the patent achieves more uniform temperature distribution while using materials with lower thermal conductivity.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If material with high thermal conductivity is used, then heat dissipation performance is improved, but cost increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the thickness parameter of the thermally conductive material layer to achieve optimal heat dissipation performance. This allows the use of materials with lower thermal conductivity (reducing cost) while compensating through geometric optimization to maintain effective heat dissipation.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

By applying different thicknesses of thermally conductive material in different regions, the patent achieves efficient heat dissipation without requiring expensive high-conductivity materials throughout the entire structure, thus reducing overall manufacturing cost.

Inventive Principle:
Principle #3Local quality

3Temperature

If fan is installed for active cooling, then heat dissipation is improved, but user comfort deteriorates near the ears

Engineering Contradiction:
Improveheat dissipationVSAvoiduser comfort
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent employs passive heat dissipation through natural convection enhanced by optimized thermal conduction paths. The thermally conductive material layer with variable thickness automatically directs heat flow without requiring active cooling components like fans, thereby maintaining user comfort while achieving effective heat dissipation.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively distributes internal heat uniformly across the case body, ensuring the head-mounted display meets production regulations while potentially reducing costs associated with high thermal conductivity materials.

Implementation Method 1

The heat source is connected to the case body through the thermally conductive material layer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

most of the heat dissipation solutions are to install uniform temperature materials on the side walls of the casing and dissipate heat through natural convection

Methodology Applied
Scientific EffectNatural convection: Free Convection

Data Source

PatentUS20250076664A1Head-mounted display
Publication Date: 2025.03.06 CORETRONIC CORPORATION
  • US20250076664A1 patent drawing
  • US20250076664A1 patent drawing
  • US20250076664A1 patent drawing

AI summary

A head-mounted display, which includes a case body, a heat source, and a thermally conductive material layer. The heat source and the thermally conductive material layer are disposed in the case body. The heat source is connected to the case body through the thermally conductive material layer. The case body has a first surface connected to the thermally conductive material layer and an opposite second surface. The thermally conductive material layer has a third surface connected to the heat source and an opposite fourth surface. A first distance is greater than a second distance, in which the first distance is a distance from the third surface adjacent to the heat source toward the second surface, and the second distance is a distance from the third surface away from the heat source toward the second surface. In this way, the internal heat of the head-mounted display can be uniformly distributed.