Hollow Boron Nitride Resin Sheet for Lightweight Heat Transfer

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Solution Overview

Problem

Existing heat transfer sheets containing boron nitride powder become heavier as the amount loaded increases, necessitating a need for weight reduction without compromising thermal conductivity.

Innovation Solution

A sheet composed of resin and boron nitride particles with hollow parts, where resin is filled into the hollow parts of the boron nitride particles, allowing for weight reduction while maintaining or enhancing thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the amount of boron nitride powder loaded into the heat transfer sheet is increased to improve thermal conductivity, then the thermal conductivity is improved, but the weight of the sheet increases

Engineering Contradiction:
Improvethermal conductivityVSAvoidweight of sheet
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

The invention uses hollow boron nitride particles as porous material structures. These particles contain internal voids or cavities that reduce the overall density and weight of the powder while maintaining the external dimensions needed for effective heat conduction pathways in the sheet.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The invention creates a composite structure by filling the hollow interior of boron nitride particles with resin material. This composite approach allows the outer boron nitride shell to provide thermal conductivity while the inner resin reduces weight, achieving a balance between thermal performance and weight reduction.

Inventive Principle:
Principle #40Composite materials

2Weight of moving object

If hollow boron nitride particles are used to reduce weight, then weight reduction is achieved, but the thermal conductivity may be compromised

Engineering Contradiction:
Improveweight of sheetVSAvoidthermal conductivity
Core Design Contradiction:
Weight of moving objectVSTemperature

Solution Approach 1:

The invention changes the physical state and composition parameters by filling the hollow space with resin material. This parameter change optimizes the balance between weight reduction (achieved through hollow structure) and thermal conductivity maintenance (achieved through resin filling that provides additional thermal pathways).

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sheet achieves weight reduction with superior thermal conductivity compared to conventional agglomerated boron nitride particles, even with reduced boron nitride content.

Implementation Method 1

the resin is filled into the hollow part of the boron nitride particle

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

heat dissipation members containing a ceramic powder having high thermal conductivity are in use

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12570836B2Sheet containing boron nitride particles each having hollow part
Publication Date: 2026.03.10 DENKA CO LTD
  • US12570836B2 patent drawing
  • US12570836B2 patent drawing
  • US12570836B2 patent drawing

AI summary

A sheet containing a resin and boron nitride particles each having a hollow part, in which the resin is filled into the hollow part of the boron nitride particles.