Hollow Column Heat Conduction Device for Enhanced Radiating Surface
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Solution Overview
Problem
Conventional heat conduction devices have limited radiating surfaces and high production costs due to complex components and assembly difficulties, which affect their radiating efficiency and quality control.
Innovation Solution
A heat conduction device with a column body featuring a recessed hollow part to increase the radiating surface, where one end is recessed to form a bowl-like or planar hollow part and the other end is a radial contact surface, allowing for enhanced heat transfer and simplified production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional heat pipes or thermal columns are used with sealed orifices and capillary structures, then the device can provide heat conduction function, but the radiating surface is limited to external wall only and the device complexity increases
Solution Approach 1:
The patent transforms the radiating surface from a two-dimensional external wall to a three-dimensional structure by creating a hollow interior cavity within the heat conduction body. This allows heat radiation to occur from both the outer surface and the inner cavity surface, effectively increasing the total radiating area without proportionally increasing the external dimensions of the device.
Solution Approach 2:
The heat conduction body is segmented into solid and hollow portions, creating an internal cavity structure. This segmentation allows the radiating surface to be divided into external and internal surfaces, both of which can independently contribute to heat dissipation, thereby increasing the overall radiating efficiency.
2Reliability
If conventional heat pipes with capillary structures and sealed orifices are used, then heat conduction function is achieved, but the assembly difficulty increases and quality control becomes problematic
Solution Approach 1:
The patent extracts and eliminates the complex capillary structures, sealed orifices, and working fluid filling processes from the heat conduction device. By removing these problematic components, the device achieves reliable heat conduction through simpler solid-state thermal conduction, significantly improving quality control and reducing assembly difficulty while maintaining the core heat transfer function.
Solution Approach 2:
The patent replaces expensive, complex heat pipe components with a simpler, more economical heat conduction body that can be manufactured using conventional machining processes. This substitution reduces manufacturing costs and improves reliability by eliminating the fragile capillary structures and sealed compartments that are difficult to produce consistently.
3Ease of manufacture
If conventional heat conduction devices with complex components are used, then heat conduction function is provided, but the production cost increases significantly
Solution Approach 1:
The patent replaces expensive heat pipe components with a simpler heat conduction body made from conventional materials like copper or aluminum. The hollow cavity structure is achieved through standard machining operations, making the device much more economical to produce while maintaining effective heat conduction performance.
Solution Approach 2:
Instead of adding complex internal structures (capillary channels, seals, working fluid) to enhance heat conduction, the patent inverts the approach by creating a hollow cavity that increases radiating surface area. This inversion simplifies the overall structure while achieving the desired thermal performance through increased surface area for radiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased radiating surface and simplified configuration lead to improved heat dissipation efficiency and reduced production costs, making the device more effective and economical.
Implementation Method 1
the heat conduction device includes a column body... The outer surface of the column body is fixed to the inside surface of the through-hole of the radiator; the contact surface is abutted to the heat generating component
Implementation Method 2
one end of the column body is recessed to form a hollow part in order to increase the radiating surface
Data Source
AI summary
A heat conduction device is fixed into a radiator (2) and abutted a heat-generating component (42). This radiator (2) has a through-hole (10). The heat conduction device includes a column body (1). One end of the column body (1) is recessed to form a hollow part in order to increase the radiating surface; the other end of the column body (1) is a contact surface (12). The outer surface of the column body (1) is fixed inside the through-hole (10) of the radiator (2), the contact surface (12) is abutted the heat generating component (42); Due to the formation of the hollow part, the radiating surface is increased, the radiating effect is enhanced, and the cost can be decreased greatly due to the simple configuration of the column body (1).