Hollow Structure Wavelength Conversion for LED Blue Light Leakage

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Solution Overview

Problem

Existing LED packaging structures allow blue light leakage, which can cause retinal damage due to its high energy and ability to penetrate the retina, posing a photobiological safety concern.

Innovation Solution

An optoelectronic device with a transparent substrate featuring a hollow structure and a wavelength conversion layer, where the wavelength conversion layer is filled within the hollow structure to reduce blue light exposure, and the manufacturing method involves forming electrodes and wavelength conversion sublayers to cover the optoelectronic chip, improving brightness and reducing blue light leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional LED packaging structure is used, then manufacturing process is simple, but blue light leakage occurs causing retinal damage

Engineering Contradiction:

Improveblue light leakageVSAvoidpackaging structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The packaging structure is segmented into multiple functional layers: a transparent substrate, a wavelength conversion layer with specific phosphors, and a hollow structure for light management. This segmentation allows each layer to address specific aspects of blue light control while maintaining overall structural functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A wavelength conversion layer containing phosphor materials is introduced as an intermediary between the LED chip and the external environment. This layer converts harmful blue light wavelengths to safer visible wavelengths, acting as a mediator that protects the retina while allowing useful light transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If wavelength conversion layer is added to reduce blue light leakage, then photobiological safety is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveretinal damage from blue lightVSAvoidmanufacturing process complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The hollow structure is pre-formed in the transparent substrate before LED chip mounting. This preliminary action allows subsequent wavelength conversion materials to be easily filled and positioned, simplifying the overall manufacturing process despite adding functional complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The wavelength conversion layer uses composite materials consisting of phosphor particles dispersed in a transparent matrix material. This composite structure enables effective blue light conversion while maintaining optical transparency and can be applied using standard manufacturing techniques.

Inventive Principle:

Principle #40Composite materials

3Object-affected harmful factors

If hollow structure is created in transparent substrate, then blue light exposure is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improveblue light exposureVSAvoidhollow structure formation precision

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The hollow structure dimensions are optimized within specific parameter ranges (depth: 0.1-1.0mm, width: 0.05-0.5mm) to achieve effective blue light blocking while accommodating variations in manufacturing precision. This parameter optimization allows standard manufacturing processes to produce functional structures.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces blue light exposure from the side of the transparent substrate when the optoelectronic chip is lit, minimizing eye damage and enhancing the brightness of the LED chip compared to traditional dispensing processes.

Implementation Method 1

the wavelength conversion layer is arranged on the two opposite surfaces of the transparent substrate and filled in the hollow structure. The optoelectronic chip is covered by the wavelength conversion layer.

Methodology Applied

Scientific EffectPhotoluminescence: Photoluminescence

Data Source

PatentUS11329200B2Optoelectronic device with wavelenghth coversion material in hollow structure for blue light leakage rate reduction

Publication Date: 2022.05.10 BRIDGELUX OPTOELECTRONICS (XIAMEN) CO LTD

AI summary

An optoelectronic device and a manufacturing method thereof are provided. The optoelectronic device includes a transparent substrate, an optoelectronic chip, electrodes and a wavelength conversion layer. The transparent substrate is provided with a hollow structure and an installation area, the hollow structure penetrates through two opposite surfaces of the transparent substrate and is located at a periphery of the installation area. The optoelectronic chip is arranged in the installation area. The electrodes are arranged on the transparent substrate and electrically connected to the optoelectronic chip; and the wavelength conversion layer is arranged on the two opposite surfaces of the transparent substrate and filled in the hollow structure, wherein the optoelectronic chip is covered by the wavelength conversion layer. The effect of reducing leakage rate of blue light of an optoelectronic device such as a LED packaging structure can be achieved.