Horizontal-Radiation Antenna Packaging Beyond Molding Thickness Limits
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Solution Overview
Problem
Existing antenna packaging structures in fan-out wafer-level packaging primarily radiate electromagnetic waves in the vertical direction, limiting further miniaturization due to process constraints of the molding thickness.
Innovation Solution
An antenna packaging structure and method that radiates electromagnetic waves in a horizontal direction, involving a support substrate, separation layer, rewiring layer, antenna array layer, molding material layer, solder ball bumps, and a chip, allowing for flexible antenna design and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antennas are designed to radiate electromagnetic waves in the vertical direction using traditional fan-out package structures, then the antenna design is constrained by process limits of molding thickness, but the device area can be reduced through integration
Solution Approach 1:
The patent changes the radiation direction of antennas from vertical to horizontal, transitioning from one-dimensional vertical stacking to two-dimensional horizontal arrangement. This dimensional change allows antennas to radiate electromagnetic waves horizontally while reducing dependence on molding thickness, thereby easing manufacturing constraints and enabling further device miniaturization
2Volume of moving object
If the molding thickness is reduced to enable further miniaturization, then the device size decreases, but the antenna design becomes more difficult due to process limits
Solution Approach 1:
By switching from vertical to horizontal radiation, the patent enables antenna designs that are less sensitive to molding thickness variations. The horizontal radiation pattern allows for more flexible antenna geometry optimization without being constrained by thin molding processes, thus maintaining manufacturing precision while achieving device miniaturization
3Ease of manufacture
If traditional vertical radiation antenna designs are used, then the structure is simpler to manufacture, but the antenna frequency is limited and device size cannot be further reduced
Solution Approach 1:
The horizontal radiation configuration enables antennas to achieve higher frequencies by optimizing the horizontal radiation pattern and reducing parasitic effects. The changed orientation allows for better control of current distribution and radiation characteristics, enabling higher operating frequencies while maintaining manufacturing feasibility through standardized horizontal layer structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables increased antenna frequency and reduced device size by allowing antennas to radiate in a horizontal direction, overcoming thickness limitations and improving device performance.
Implementation Method 1
the antenna array layer includes a plurality of antennas arranged in an array, the plurality of antennas radiates electromagnetic waves in a horizontal direction
Data Source
AI summary
The present disclosure provides an antenna packaging structure radiating electromagnetic waves in a horizontal direction parallel to the device plane and a method making the same. The method includes: providing a support substrate, and forming a separation layer; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes a plurality of antennas which radiates e-m waves in a horizontal direction; each antennas comprises first metal sheets extending along a first direction and second metal sheets extending along a second direction, the first metal sheets are arranged with sheets in parallel and spaced by an sheet-to-sheet interval, second metal sheets are arranged with sheets in parallel and spaced by an sheet-to-sheet interval; forming a molding material layer, which molds the antenna array layer.