Horizontal Buffing Module for CMP Throughput

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Solution Overview

Problem

The existing vertical buffing modules in semiconductor device manufacturing limit substrate processing throughput due to a restricted cleaning area and increased system size, necessitating a more efficient substrate cleaning method.

Innovation Solution

A horizontal buffing module with a rotatable vacuum table and pad conditioning station, featuring a pad carrier positioning arm and a buffing pad with a diameter of 67 mm or more, applied with a pressure of 3 psi or more, to clean substrates in a horizontal orientation, enhancing cleaning efficiency and reducing system footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a vertical buffing module is used to clean substrate surfaces, then the substrate can be held vertically for cleaning, but the outer diameter of the buffing pad is limited which restricts the cleaning area and reduces substrate processing throughput

Engineering Contradiction:

Improvesubstrate cleaning capabilityVSAvoidsubstrate processing throughput

Core Design Contradiction:

Ease of operationVSProductivity

Solution Approach 1:

The patent inverts the conventional vertical substrate orientation to a horizontal orientation during buffing. By rotating the substrate holder horizontally and positioning the buffing pad above the substrate surface, the system enables larger buffing pad diameters (e.g., 150 mm or more) to be used, thereby increasing the cleaning area and processing throughput while maintaining effective substrate cleaning capability

Inventive Principle:

Principle #13The other way round (Inversion)

2Ease of operation

If a vertical buffing module is used to hold substrate in vertical orientation, then substrate cleaning can be performed, but large overhead clearance is required for insertion and removal of substrate which increases overall system size and footprint

Engineering Contradiction:

Improvesubstrate insertion and removalVSAvoidsystem footprint

Core Design Contradiction:

Ease of operationVSArea of stationary object

Solution Approach 1:

The patent inverts the substrate orientation from vertical to horizontal during the buffing process. The substrate is held horizontally on a rotatable substrate holder, and the buffing pad is positioned above the substrate surface. This configuration eliminates the need for large overhead clearance for substrate insertion and removal, thereby reducing the overall system footprint while maintaining ease of operation

Inventive Principle:

Principle #13The other way round (Inversion)

3Productivity

If a larger buffing pad is used to increase cleaning area, then substrate processing throughput can be improved, but the vertical orientation constraint of existing modules limits the maximum buffing pad diameter

Engineering Contradiction:

Improvesubstrate processing throughputVSAvoidmodule configuration constraint

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent resolves the device complexity constraint by inverting the substrate orientation to horizontal and reconfiguring the buffing module architecture. The substrate holder rotates horizontally with the substrate surface facing upward, allowing buffing pads with diameters of 150 mm or more to be used. This configuration increases the cleaning area and substrate processing throughput while maintaining manageable module complexity through a redesigned but straightforward horizontal processing architecture

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The horizontal buffing module increases substrate processing throughput by allowing larger buffing pads and reducing the overall size of the CMP system, thereby improving manufacturing efficiency and space utilization.

Implementation Method 1

a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a plurality of annular channels defined in a substrate receiving surface thereof

Methodology Applied

Scientific EffectVacuum: Vacuum

Data Source

PatentUS20220134505A1Horizontal buffing module

Publication Date: 2022.05.05 APPLIED MATERIALS INC

AI summary

A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including an array of channels defined in a supporting surface thereof. The module includes a pad conditioning station disposed proximate to the rotatable vacuum table. The module includes a pad carrier positioning arm coupled to a pad carrier assembly. The module includes an actuator coupled to the pad carrier positioning arm and configured to position the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station.