Electronic Component Housing Package with Inclined Sections
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Solution Overview
Problem
Existing electronic component housing packages face challenges in maintaining reliable electrical connections and shock resistance due to the spreading of metallization paste during the pressure applying process, which can lead to breaks in wiring and reduced conductive properties, especially when the size of the components is reduced.
Innovation Solution
The electronic component housing package design features a base section with a mounting section, a projecting part, a frame part, a frame-shaped metalized layer, external connection conductors, connection conductors that gradually increase in thickness towards the wiring conductors, and a pressure applying process that forms projecting parts with inclined sections to bury the connection conductors, reducing the likelihood of breaks and enhancing shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of electronic components is reduced, then miniaturization is achieved, but the reliability of electrical connections deteriorates due to metallization paste spreading
Solution Approach 1:
The patent applies preliminary action by forming the projecting part with an inclined section before the pressure applying process. This pre-formed structure allows the connection conductor to be properly positioned and buried during subsequent processing, preventing metallization paste spreading issues even when components are miniaturized. The inclined section is created in advance to guide the conductor embedding process.
Solution Approach 2:
The patent applies local quality by creating a specific inclined section only in the region where connection conductors need to be embedded. This localized structural modification allows different parts of the component to have different properties: the inclined section provides conductor burial capability while other areas maintain standard characteristics. This resolves the contradiction by providing enhanced connection reliability specifically where needed without increasing overall component size.
2Ease of manufacture
If metallization paste is applied during pressure applying process, then electrical connections are formed, but wiring breaks occur due to paste spreading
Solution Approach 1:
The patent introduces the inclined section as an intermediary structure that mediates between the metallization paste application process and the final wiring integrity. The inclined section acts as a guiding structure that contains the paste spreading and provides a controlled path for conductor embedding, thereby maintaining both ease of manufacture and wiring integrity simultaneously.
Solution Approach 2:
The inclined section provides beforehand cushioning by creating a structural buffer zone that absorbs and controls the spreading of metallization paste. This pre-formed inclined structure cushions against the harmful effects of paste spreading before it can cause wiring breaks, allowing the pressure applying process to proceed effectively while maintaining wiring integrity.
3Ease of operation
If connection conductors are exposed on the surface, then electrical connections are accessible, but shock resistance is reduced
Solution Approach 1:
The patent applies the nesting principle by embedding the connection conductor within the inclined section of the projecting part. The conductor is nested inside the ceramic structure rather than being exposed on the surface, which provides mechanical protection and shock resistance while maintaining electrical connectivity. The conductor is surrounded and protected by the ceramic matrix, similar to how nested dolls provide protection through layered structures.
Data Source
AI summary
An electronic component housing package includes: a base section having a mounting section for an electronic component; a projecting part that is positioned on the base section and projects from the base section; a frame part that is positioned on the base section and surrounds the mounting section; a frame-shaped metalized layer that is positioned on the frame part; a plurality of external connection conductors that is positioned opposite the mounting section in the thickness direction; a connection conductor which is positioned on the projecting part and for connecting to the electronic component; and a wiring conductor that is connected to the connection conductor and that is led out to the base section. The thickness of the connection conductor gradually increases toward the wiring conductor.