3D-Printed HTS Current Lead Assembly for Low Cryogen Boil-Off

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Solution Overview

Problem

Existing lead assemblies for cryogenic systems are prone to high boil-off rates of cryogen due to thermal conductivity and require time-consuming and costly redesigns when modifications are needed, and they often have unreliable electrical connections.

Innovation Solution

A lead assembly comprising a heat exchanger made of electrically and thermally conductive materials with a high-temperature superconductor (HTS) assembly, designed using additive manufacturing to maintain the HTS at or below its critical superconducting temperature, reducing thermal conductivity and boil-off, and allowing for a stand-alone operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional lead assemblies use thermally conductive materials to ensure electrical conductivity, then electrical connections are reliable, but thermal conductivity causes high cryogen boil-off rates

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidcryogen boil-off rate
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The lead assembly is segmented into multiple sections with different thermal conductivities. The upper portion uses highly thermally conductive materials for reliable electrical connection, while the lower portion uses low thermal conductivity materials to reduce heat transfer to the cryogenic system, thereby reducing cryogen boil-off rate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different sections of the lead assembly have different thermal properties tailored to their specific functions. The section requiring reliable electrical connection has high thermal conductivity, while the section interfacing with the cryogenic system has low thermal conductivity to minimize heat leakage and reduce boil-off.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conventional manufacturing methods (casting, machining, metal injection molding) are used for lead assemblies, then production is established, but design modifications require new molds which are time-consuming and costly

Engineering Contradiction:
Improvemanufacturing process stabilityVSAvoiddesign modification flexibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent employs additive manufacturing technology that allows rapid modification of design parameters without requiring new molds. Design changes can be implemented by updating digital models and re-printing components, significantly reducing the time and cost associated with design modifications while maintaining manufacturing capability.

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If the heat exchanger cross-sectional area is reduced to lower thermal conductivity, then cryogen boil-off rate decreases, but the structural integrity and electrical connection reliability may be compromised

Engineering Contradiction:
Improvecryogen boil-off rateVSAvoidstructural integrity
Core Design Contradiction:
Loss of energyVSStrength

Solution Approach 1:

The heat exchanger incorporates composite material structures that provide both mechanical strength and controlled thermal conductivity. The composite design allows the cross-sectional area to be reduced for lower heat transfer while maintaining structural integrity through optimized material composition and structural configuration.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces cryogen boil-off rates, simplifies cooling mechanisms, and enables reliable electrical connections, lowering operational costs and maintaining efficient cryogenic system performance.

Implementation Method 1

The heat exchanger is composed of an electrically-conductive and thermally-conductive material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an HTS assembly coupled between the cryogenic apparatus and the heat exchanger at the second end of the heat exchanger, the HTS assembly including an HTS strip

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Data Source

PatentUS12537121B2High temperature superconducting current lead assembly for cryogenic apparatus
Publication Date: 2026.01.27 GE PRECISION HEALTHCARE LLC
  • US12537121B2 patent drawing
  • US12537121B2 patent drawing
  • US12537121B2 patent drawing

AI summary

A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.