High Voltage Bridge Rectifier Parasitic Inductance Reduction
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Solution Overview
Problem
High voltage bridge rectifiers face challenges in minimizing parasitic inductance and surge current while maintaining a small size and efficient high voltage rectification conversion, particularly in power conversion devices for electric vehicles and telecommunication systems.
Innovation Solution
A high voltage bridge rectifier design featuring a substrate with equivalent diode circuits, including low voltage diodes and high voltage normally-on transistors, interconnected with terminal and element pads, and a molding layer to reduce parasitic inductance and surge current, and a capacitor electrode for EMI filtering, optimized for efficient high voltage rectification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional bridge rectifier designs are used, then the rectifier can perform high voltage conversion, but parasitic inductance and surge current increase
Solution Approach 1:
The substrate is divided into multiple insulation layers with element pads and terminal pads arranged in specific patterns. This segmentation allows optimization of current paths and reduction of parasitic inductance while maintaining electrical isolation between different circuit elements
Solution Approach 2:
The patent utilizes multi-layer substrate structure with pads arranged in specific two-dimensional patterns. By distributing pads across different layers and positions, the design reduces current loop areas and minimizes parasitic inductance without increasing the overall device footprint
2Volume of moving object
If the rectifier size is reduced, then integration is improved, but heat dissipation and electrical performance may deteriorate
Solution Approach 1:
The patent employs a compact multi-layer substrate design that integrates multiple functional elements in a small footprint. The element pads and terminal pads are strategically positioned to minimize device size while maintaining effective heat dissipation paths through the substrate structure
Solution Approach 2:
Multiple functional components are integrated into a single substrate structure, combining rectification, heat dissipation, and electrical connection functions. This merging reduces overall device size while maintaining performance through optimized material selection and structural design
3Object-affected harmful factors
If element pads and terminal pads are optimally positioned, then parasitic inductance is minimized, but manufacturing complexity increases
Solution Approach 1:
The substrate is segmented into multiple insulation layers with pads positioned in optimized patterns. This segmentation enables minimal parasitic inductance design while using standard manufacturing processes for each layer, reducing overall manufacturing complexity
Solution Approach 2:
The pad positions and substrate structure are pre-designed and pre-fabricated as integrated components. This preliminary action optimizes electrical performance before final assembly, reducing the need for complex post-processing or manual adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively minimizes parasitic inductance and surge current, enhances the stability and efficiency of high voltage rectification, and reduces the size of the rectifier, addressing the limitations of existing technologies in power conversion applications.
Implementation Method 1
a capacitor electrode disposed within the insulation layer and aligned with the cathode and anode terminal pads
Data Source
AI summary
Provided is a high voltage bridge rectifier. The high voltage bridge rectifier includes a supporter, a substrate on the supporter, a plurality of equivalent diode circuits mounted on the substrate, interconnection lines, and terminals. The substrate may include an insulation layer, element pads disposed on a center of the insulation layer, and terminal pads disposed on an edge of the insulation layer to surround the element pads.