Hybrid Bonding Sequence for Multi-Source Die Activation Timing
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Solution Overview
Problem
Coordinating the inline activation processes for hybrid bonding of multiple die sources is difficult and often impossible with traditional standalone bonders, leading to inefficiencies and user mistakes.
Innovation Solution
A method for sequencing a hybrid bonding process that involves selecting sources and targets, forming an integrated bonding product sequence, and determining process chamber allocations and timing to optimize throughput and reduce queue times, using a user interface to facilitate linking and synchronization of source and target sequences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional standalone bonders are used for hybrid bonding, then device complexity is reduced, but coordinating inline activation processes for multiple die sources becomes extremely difficult or impossible
Solution Approach 1:
The patent combines multiple process chambers (activation chambers for sources and targets, and bonding chambers) into a single integrated hybrid bonding tool. This merging allows coordinated inline activation processes for multiple die sources and targets, resolving the coordination difficulty while maintaining manageable complexity through unified control.
Solution Approach 2:
The integrated bonding tool performs multiple functions: activating source substrates, activating target substrates, and bonding dies to targets. This multi-functionality enables the tool to handle complex hybrid bonding sequences with multiple die sources in a coordinated manner, improving ease of operation.
2Productivity
If multiple die sources are processed inline, then productivity increases, but coordinating activation processes becomes extremely difficult or impossible
Solution Approach 1:
The patent implements dynamic sequencing capabilities that allow flexible coordination of activation processes for multiple die sources. The system can adaptively manage the timing and order of activation for different sources and targets, enabling high productivity while maintaining ease of operation through intelligent process orchestration.
Solution Approach 2:
The integrated tool incorporates feedback mechanisms that monitor the status of multiple sources and targets during inline processing. This feedback enables real-time coordination of activation processes, ensuring that each source and target is properly prepared before bonding, thereby maintaining ease of operation even with multiple die sources.
3Manufacturing precision
If integrated bonding product sequence is formed with multiple sources and targets, then manufacturing precision improves, but process sequencing complexity increases
Solution Approach 1:
The patent segments the overall bonding process into distinct sequences for each source and target, with clear linkages between them. This segmentation allows precise control of the bonding process for multiple sources and targets while managing complexity through modular sequence organization, improving manufacturing precision.
Data Source
AI summary
A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding a die from the source to the target using the integrated bonding product sequence.