Hybrid Bump Grouping for Faster 3DIC Verification
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Solution Overview
Problem
Existing methods for verifying and simulating hybrid bumps in 3D integrated circuits (3DICs) are computationally expensive and inefficient, particularly in the simulation of electrostatic discharge (ESD) and other circuit verification processes, due to the high number of simulations required for each individual bump, which can be time-consuming and resource-intensive without costly high-performance computing systems.
Innovation Solution
Implementing a hybrid bump grouping technology that automatically identifies and groups hybrid bumps based on their pitch values, allowing for representative simulations to be performed on grouped bumps rather than individual ones, reducing the number of required simulations by up to 50%, 75%, or 88%.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If individual hybrid bump simulations are performed for verification, then simulation accuracy is improved, but computational cost and time consumption increase significantly
Solution Approach 1:
The patent merges multiple individual bump simulations into a single unified simulation by combining the bump structures into one integrated model. This allows verification of multiple bumps simultaneously, reducing computational time while maintaining simulation accuracy through the unified approach.
Solution Approach 2:
The unified bump structure serves multiple verification functions simultaneously, allowing a single simulation to verify electrical characteristics, thermal properties, and mechanical stability across multiple bumps. This multi-functional approach eliminates the need for separate simulations for each bump type.
2Reliability
If individual hybrid bump simulations are performed for verification, then simulation completeness is improved, but resource consumption increases significantly
Solution Approach 1:
The patent combines multiple bump verifications into a single computational resource pool by creating a unified simulation model. This merging allows the system to verify all bumps using shared computational resources, reducing overall energy consumption while maintaining complete verification coverage.
3Adaptability or versatility
If manual bump grouping and simulation setup is performed, then simulation customization is improved, but manual effort and complexity increase
Solution Approach 1:
The system automatically performs bump identification, grouping, and simulation setup without requiring manual intervention. The automated processes detect bump characteristics, organize them into appropriate groups, and configure simulations independently, eliminating manual effort while maintaining customization through adaptive algorithms.
Solution Approach 2:
The system dynamically adjusts simulation parameters based on automatically detected bump characteristics and grouping criteria. This parameter adaptation maintains simulation customization and versatility while eliminating the need for manual configuration, as the system self-adjusts to optimal settings based on the specific bump array being verified.
Data Source
AI summary
Systems and methods are presented for group-based simulations of hybrid bumps of circuit designs for 3-dimensional integrated circuits (3DICs). A method may include identifying hybrid bumps for an input circuit design, and each hybrid pump may represent a connection element between circuits of a 3-dimensional integrated circuit (3DIC) structure. The method may also include grouping the hybrid bumps into bump groups based on a pitch value that specifies a distance between the hybrid bumps from one another, wherein each bump group comprises multiple hybrid bumps. For a given bump group of the bump groups, the method may include performing a point-to-point simulation from a representative point determined for the given bump group and using a result of the point-to-point simulation from the representative point as a simulation result for each of the multiple hybrid bumps included in the given bump group.