Hybrid Cooling Server Rack with Conductive Structural Component
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Solution Overview
Problem
Current server rack cooling systems face challenges in efficiently managing heat dissipation, as they often require extensive active cooling, which increases costs and reduces reliability, while passive cooling may not suffice for components generating higher heat levels.
Innovation Solution
The implementation of a hybrid cooling system within server racks, utilizing a heat conducting structural component to facilitate directed and controlled heat transfer between passively cooled components and a cold plate, thereby reducing the need for additional active cooling and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling is provided to all components, then cooling effectiveness is improved, but manufacturing costs and operational energy costs increase
Solution Approach 1:
The patent applies different cooling strategies to different components based on their heat generation characteristics. High-power components receive active cooling via cold plates, while low-power components rely on passive cooling through the rack housing. This localized differentiation optimizes energy consumption while maintaining adequate cooling effectiveness where needed.
Solution Approach 2:
The cooling system is segmented into active cooling zones (with cold plates for high-power components) and passive cooling zones (using rack housing for low-power components). This segmentation allows the system to provide intensive cooling only where necessary, reducing overall energy consumption while maintaining cooling effectiveness for critical components.
2Temperature
If active cooling components are added, then cooling effectiveness is improved, but system reliability decreases due to more moving parts
Solution Approach 1:
Active cooling components (cold plates) are deployed only at specific locations where high-power components generate excessive heat, rather than throughout the entire rack. This localized approach minimizes the number of moving parts and potential failure points while maintaining cooling effectiveness for critical components.
Solution Approach 2:
The cooling system divides components into two segments: those requiring active cooling (with cold plates) and those that can be passively cooled. This segmentation reduces the overall number of active cooling components and moving parts in the system, thereby improving reliability while maintaining adequate cooling for high-power devices.
3Ease of manufacture
If passive cooling is used for all components, then manufacturing costs are reduced, but cooling effectiveness is insufficient for high heat generation
Solution Approach 1:
The system segments components based on their cooling requirements: high-power components receive active cooling via cold plates, while low-power components use passive cooling through the rack housing. This segmentation allows the system to maintain cost-effectiveness through passive cooling for most components while providing enhanced active cooling only where heat generation demands it.
Solution Approach 2:
The rack housing serves multiple functions: it provides structural support, electrical routing, and passive cooling for low-power components. By making the housing multi-functional, the system reduces the need for additional dedicated cooling components, thereby controlling manufacturing costs while maintaining adequate cooling effectiveness through the combined passive and active cooling approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for targeted cooling of components, reducing operational costs and maintaining system reliability by providing an intermediate level of cooling that supplements both passive and active cooling methods, effectively managing heat dissipation without the need for excessive active cooling components.
Implementation Method 1
a hybrid cooling system (400), configured to provide a heat transfer (465) from the passively cooled component to the cold plate (310) by heat conduction via the structural component (140)
Data Source
AI summary
A server rack system for receiving and coupling one or more electronic components to a vehicle system includes a housing. The housing is configured to receive the one or more electronic components. The server rack system includes a heat-conducting structural component. A cooling system includes a heat source and a heat sink. An active cooling system includes a cold plate coupled to a cooling system defining a heat sink. A passively cooled electronic component defines a heat source. A hybrid cooling system is configured to provide a heat transfer from the passively cooled electronic component to the cold plate by heat conduction via the structural component.