Hybrid Core Substrate With Embedded Components for Shorter Signal Paths
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Solution Overview
Problem
Conventional packaging substrates with thick cores face issues of increased distance between components due to core thickness, leading to ineffective performance of components like bypass capacitors due to resistance, inductance, or capacitance in long metal paths.
Innovation Solution
A hybrid core substrate design with embedded components, featuring a rigid core and stacked laminate layers with embedded components, reducing core thickness and minimizing component distances through laminate layer structures and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a thick core is used to maintain flatness with large body substrates, then structural stability is improved, but the distance between components increases leading to degraded electrical performance
Solution Approach 1:
The patent transitions from a conventional thick-core vertical stacking approach to a hybrid core design where laminate layers are folded back and embedded within the core structure. This dimensional reorganization allows components to be positioned closer in the vertical dimension while maintaining overall structural flatness, effectively reducing the electrical path length without sacrificing mechanical stability.
Solution Approach 2:
The patent embeds laminate layers containing components within cavities of the hybrid core structure. This nesting approach allows the laminate layers to be integrated into the core volume rather than extending outward, reducing the overall distance between components while maintaining the external flatness required for large body substrate integration.
2Strength
If a thick core is used to maintain flatness, then structural integrity is improved, but component effectiveness deteriorates due to long metal paths
Solution Approach 1:
By folding laminate layers back and embedding them within the hybrid core, the patent creates a three-dimensional integrated structure that simultaneously maintains structural integrity and minimizes electrical path lengths. This dimensional transformation allows bypass capacitors and other components to be positioned much closer to their associated ICs, reducing resistance, inductance, and capacitance in the metal paths while the hybrid core maintains overall structural strength.
Solution Approach 2:
The patent creates localized regions within the hybrid core where laminate layers are embedded at different positions and orientations. This allows different parts of the structure to have optimized local properties - areas with embedded layers have reduced component distances for electrical performance, while the overall hybrid core structure maintains structural integrity. The embedded components are strategically positioned to minimize metal path lengths without compromising the global structural strength.
3Ease of manufacture
If conventional thick core design is used, then manufacturing simplicity is maintained, but package size and cost increase
Solution Approach 1:
The patent embeds laminate layers within cavities of the hybrid core, creating a nested structure that reduces the overall package volume. By integrating the laminate layers into the core volume rather than having them extend outward as separate thick sections, the patent achieves compact packaging while maintaining all necessary electrical connections and structural properties.
Solution Approach 2:
The patent merges the core structure and laminate layers into a single integrated hybrid core substrate. By combining these previously separate elements into one unified structure with embedded layers, the patent reduces the overall package size and simplifies the manufacturing process, eliminating the need to assemble separate thick core and laminate components.
Data Source
AI summary
A hybrid core substrate with embedded components, and methods for making the same, are disclosed. In an aspect a hybrid core substrate comprises a rigid core, a first laminate layer structure disposed above and mounted to the top surface of the rigid core and having a cavity in which a first component is embedded, and a second laminate layer structure disposed above and mounted to a top surface of the first laminate layer structure and having at least one electrical connection to the first laminate layer structure and at least one electrical connection to the first component, a first plurality of contacts disposed on the top surface of the second laminate layer structure and electrically connected to the second laminate layer structure. In some aspects, at least one contact is electrically connected to the embedded component.