Hybrid Detector Array Imaging for Broad Wavelength Capture
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Solution Overview
Problem
Existing imaging devices struggle to efficiently detect a broad range of wavelengths using silicon-based light detection, and there is a need for improvements in combining different types of light detecting units in a compact imaging device for fast imaging.
Innovation Solution
The imaging device incorporates an array of light detecting units of two types on a common semiconductor substrate, where the first type detects light in a specific wavelength range tied to the substrate material, and the second type uses a stacked layer structure to detect light in a different wavelength range, allowing for simultaneous read-out of signals from both types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If silicon-based light detection is used, then the imaging device can be compact and integrated with semiconductor circuitry, but the wavelength detection range is limited by silicon's optical characteristics
Solution Approach 1:
The imaging device divides the detector array into multiple types of light detecting units (first type for first wavelength range, second type for second wavelength range) that are spatially separated and arranged in specific patterns. Each type is optimized for its designated wavelength range, allowing the system to achieve broad spectral coverage without requiring a single complex detector type to handle all wavelengths
Solution Approach 2:
The patent combines different light detecting unit types with distinct optical characteristics on the same semiconductor substrate. The first type of light detecting unit detects light in a first wavelength range while the second type detects light in a second wavelength range, creating a composite detection system that leverages the complementary strengths of different detector materials and structures
2Adaptability or versatility
If multiple types of light detecting units are combined to detect broad wavelengths, then spectral coverage is improved, but the device size and complexity increase
Solution Approach 1:
The patent merges multiple types of light detecting units onto a single semiconductor substrate, integrating both first type and second type detectors in close proximity. This consolidation achieves broad wavelength detection while maintaining a compact form factor, as the different detector types share common infrastructure including readout electronics and substrate support
Solution Approach 2:
The patent arranges different types of light detecting units at different spatial positions and orientations on the semiconductor substrate. By utilizing two-dimensional spatial arrangement and lateral displacement, the system accommodates multiple detector types without significantly increasing the overall device footprint, effectively packing diverse detection capabilities into a compact area
3Measurement precision
If different types of light detecting units are used for broad wavelength detection, then spectral resolution is improved, but simultaneous read-out of all wavelength bands becomes complex
Solution Approach 1:
The patent implements readout electronics that can simultaneously handle multiple types of light detecting units through a unified control architecture. The readout circuitry is designed to accept signals from both first type and second type detectors using common timing signals, enabling synchronized readout of all wavelength bands without requiring separate complex control systems for each detector type
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-speed imaging of a broad range of wavelengths in a compact device, providing high spectral resolution and avoiding motion blur between different wavelength bands.
Implementation Method 1
a photo-sensitive area of a first type formed in or at a main surface of the semiconductor substrate
Implementation Method 2
an active layer, which forms a photo-sensitive area of a second type and is configured to generate charges in response to incident light
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An imaging device (100) comprises: a semiconductor substrate (102); and an array (110) of light detecting units (112a-d), wherein the array (110) comprises light detecting units (112a-c) of a first type for detecting light in a first wavelength range, each comprising a photo-sensitive area (120) formed in or at a main surface (104) of the semiconductor substrate (102), wherein the array (110) further comprises light detecting units (112d) of a second type for detecting light in a second wavelength range, each comprising a stacked layer structure (130) formed on the main surface (104), wherein the light detecting units of the first and the second types are configured to detect spatially separate light; wherein the imaging device (100) further comprises read-out electronics (150) for simultaneous read out of signals representative of light incident on the light detecting units (112a-d) of the first type and the second type.