Hybrid Diaphragm Speaker Structure for Thin Device Integration
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Solution Overview
Problem
Existing speaker structures are not suitable for integration into miniaturized multimedia devices due to their size and manufacturing limitations.
Innovation Solution
A hybrid diaphragm structure with a voice coil integrated on the diaphragm, formed using semiconductor manufacturing processes, which allows for miniaturization and integration with other applications like LED/OLED displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If traditional speaker structures are used, then sound production function is achieved, but device size and weight increase
Solution Approach 1:
The patent combines the voice coil and diaphragm into an integrated hybrid diaphragm structure where the voice coil is formed directly on the diaphragm surface. This merging of previously separate components (voice coil assembly and diaphragm) into a single integrated unit reduces overall speaker size and weight while maintaining sound production functionality, enabling integration into portable multimedia devices
2Length of moving object
If traditional speaker structures are used, then sound production function is achieved, but device thickness increases
Solution Approach 1:
The patent transitions from a traditional three-dimensional speaker structure with deep magnetic assemblies to a planar two-dimensional hybrid diaphragm structure. The voice coil is formed on the surface of the diaphragm in a flat configuration, eliminating the need for deep magnetic assemblies and enabling the speaker to be integrated into thin portable devices while maintaining sound production capability
3Volume of moving object
If speaker components are integrated, then device miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the manufacturing approach from traditional mechanical assembly of separate speaker components to a semiconductor-style thin-film deposition process. By depositing conductive and magnetic materials in thin layers directly onto the diaphragm substrate and patterning them through photolithography, the complex integrated structure is manufactured with simple planar processes, reducing manufacturing complexity despite the integrated design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid diaphragm structure enables miniaturization of speakers, enhancing their practicality and performance, and allows integration with other devices.
Implementation Method 1
a coil structure disposed over the third surface of the vibrating part
Data Source
Figure 1
Figure 2A~2D
Figure 3
AI summary
A hybrid diaphragm structure (200) is provided. The hybrid diaphragm structure (200) includes a substrate (110), a first diaphragm (152) disposed in a central region of the substrate, a first coil structure (154) disposed over the first diaphragm, a first groove (160) separating the first diaphragm and the first coil structure from the substrate, and a first bridge structure (170) coupling the first diaphragm to the substrate. The first diaphragm (152) and the substrate (110) include a same material.