Hybrid Finite Element Circuit Simulation via Signal Element Removal
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Solution Overview
Problem
Current high-speed integrated circuit, integrated circuit package, and printed circuit board design simulations face challenges with long computation times due to the complexity of full-wave solvers, particularly in handling signal transmission elements like vias and transmission lines, which are time-consuming and often result in inaccurate results over multi-GHz bandwidths.
Innovation Solution
The method involves simplifying the circuit design by removing certain signal transmission elements and incorporating their electrical parameters into a 3D finite element method analysis, allowing for faster computation while retaining the electrical impact on the package, using a hybrid approach that combines 2.5D hybrid tools with 3D solving techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If full-wave electromagnetic solvers are used for accurate power and signal integrity analysis, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The patent segments the electromagnetic solver into two distinct components: a 2.5D hybrid solver that handles signal transmission elements (via holes, transmission lines) efficiently, and a 3D finite element solver that handles the remaining package structure. This segmentation allows each solver to operate in its optimal domain, with the 2.5D solver providing fast accurate results for transmission elements and the 3D solver providing accurate results for the complex 3D structure, thereby reducing overall computation time while maintaining measurement precision.
Solution Approach 2:
The patent extracts signal transmission elements (via holes, transmission lines, pads) from the full 3D model and processes them separately using a specialized 2.5D hybrid solver. This extraction allows these elements to be handled more efficiently without requiring the computationally intensive 3D full-wave solver, thus reducing loss of time while maintaining the accuracy needed for power and signal integrity analysis.
2Measurement precision
If full-wave electromagnetic solvers are used for broadband analysis, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent divides the solver system into two specialized components with distinct roles: a 2.5D hybrid solver for handling signal transmission elements and a 3D finite element solver for the package structure. Each solver is optimized for its specific domain, reducing the overall complexity compared to using a single full-wave solver for all tasks. The segmentation allows simpler solvers to be used where appropriate, reducing device complexity while maintaining measurement precision through the coordinated operation of both solvers.
3Measurement precision
If traditional 3D solving techniques are used for complex designs, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The patent segments the design into transmission line elements and 3D package structures, applying the most appropriate solver to each segment. The 2.5D hybrid solver efficiently handles the transmission line elements with high accuracy, while the 3D finite element solver processes the package structures. This segmentation enables the simulation to achieve measurement precision comparable to full 3D solving but with significantly reduced simulation time.
Solution Approach 2:
The patent applies different solution methods with locally optimal properties to different parts of the design. The 2.5D hybrid solver is applied locally to signal transmission elements where it provides both accuracy and efficiency, while the 3D finite element solver is applied to the package structure where it provides the necessary precision. This local quality approach ensures measurement precision is improved where needed while reducing loss of time in regions where simpler methods suffice.
Data Source
AI summary
Systems and methods are provided for performing a simulation of an integrated circuit, integrated circuit package, or printed circuit board design. A representation of the design is accessed that includes a plurality of components inside a volume. The volume is discretized into a plurality of volumetric elements. A removable signal transmission element is identified in the volume. The signal transmission element is removed from the volume. An electrical parameter associated with the removed signal transmission element is identified. A finite element method operation is performed to identify a characteristic of the design based on the discretized volume having the signal transmission element removed and the electrical parameter, an electrical impact of the signal transmission element on the package being retained based on the electrical parameter.