Hybrid Microelectronic Substrate Embedding High-Density Patch
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The microelectronic industry faces challenges in attaching microelectronic devices to substrates due to the difficulty in forming electrical interconnections as device sizes decrease, with high-density electrical routing requiring expensive lithography processes and interposers that can reduce electrical performance and increase thickness.
Innovation Solution
A hybrid microelectronic substrate is developed by embedding a high-density microelectronic patch substrate within a lower-density microelectronic substrate, allowing for direct flip-chip attachment with high-density interconnections where needed and lower-density routes elsewhere, using dielectric and conductive materials with appropriate fabrication methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-density electrical routing is used to attach microelectronic devices, then electrical interconnection capability is improved, but manufacturing cost increases due to expensive lithography processes
Solution Approach 1:
The patent applies local quality by creating a hybrid substrate where only the necessary high-density patch substrate area is fabricated with high-density routing, while the remainder of the substrate uses cost-effective lower-density routing. This localized approach provides high electrical interconnection capability exactly where needed for the microelectronic device attachment, while avoiding the prohibitive costs of fabricating the entire substrate with high-density routing.
2Adaptability or versatility
If an interposer is used to connect microelectronic device to substrate, then electrical routing flexibility is improved, but electrical performance deteriorates and thickness increases
Solution Approach 1:
The patent extracts the unnecessary interposer layer from the structure by directly integrating the high-density patch substrate into the lower-density substrate. This eliminates the additional thickness and potential electrical performance degradation that would result from using a separate interposer, while still providing the needed routing flexibility through the hybrid substrate design.
Solution Approach 2:
The patent implements nesting by embedding the high-density patch substrate within the lower-density substrate structure. The high-density patch substrate is positioned and integrated directly into the hybrid substrate, creating a nested configuration that provides routing flexibility without requiring a separate interposer layer, thereby maintaining better electrical performance and reducing overall thickness.
3Reliability
If high-density electrical routing is used throughout the substrate, then electrical interconnection density is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by restricting high-density routing to only the necessary patch substrate area where microelectronic device attachment is required. The remainder of the substrate uses simpler, lower-density routing, thereby reducing overall substrate complexity while maintaining high electrical interconnection density exactly where it is needed.
Data Source
AI summary
A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.