Hybrid Multi-Die Package Layout Using Metal Core Connectors
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Solution Overview
Problem
Existing semiconductor device packages face challenges in accommodating sophisticated features that impact reliability, performance, and cost, necessitating improved packaging configurations.
Innovation Solution
A hybrid multi-die package configuration is implemented, where a packaged device with a first semiconductor die is mounted on a base leadframe using metal core connectors, and a second semiconductor die is mounted on a package leadframe, with exposed leads for external component attachment, enabling a cost-effective package-on-package (PoP) arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hybrid multi-die package configuration is implemented, then reliability and performance are improved, but device complexity increases
Solution Approach 1:
The semiconductor device is divided into multiple independent semiconductor dies (first semiconductor die, second semiconductor die) mounted on separate leadframes (base leadframe, package leadframe). This segmentation allows each die to be optimized independently for specific functions, improving overall reliability while distributing complexity across modular units that can be manufactured and tested separately before final assembly.
Solution Approach 2:
The package leadframe with the first semiconductor die is mounted within the base leadframe structure that contains the second semiconductor die. This nested arrangement integrates multiple functional units into a compact hybrid multi-die package, improving performance through close integration while containing complexity within a standardized package architecture.
2Reliability
If multiple semiconductor dies are integrated in a hybrid multi-die package, then performance is improved, but manufacturing complexity increases
Solution Approach 1:
Each semiconductor die is mounted and connected to its respective leadframe in separate preliminary assembly steps before final integration. The first semiconductor die is mounted on the package leadframe, and the second semiconductor die is mounted on the base leadframe independently. This preliminary action allows each sub-assembly to be manufactured, tested, and optimized separately, reducing overall manufacturing complexity despite integrating multiple dies.
Solution Approach 2:
Metal core connectors serve as intermediary elements that facilitate the connection between the package leadframe and the base leadframe. These standardized connectors simplify the integration process by providing pre-defined electrical and mechanical interfaces, reducing manufacturing complexity while enabling high-performance multi-die integration.
3Productivity
If a package-on-package configuration is used, then integration efficiency is improved, but device complexity increases
Solution Approach 1:
The hybrid multi-die package employs a three-dimensional package-on-package configuration where the package leadframe with the first semiconductor die is mounted vertically or at an angle on the base leadframe that contains the second semiconductor die. This dimensional arrangement achieves high integration efficiency by stacking functional units vertically rather than spreading them horizontally, improving productivity while managing complexity through spatial organization.
Data Source
AI summary
A method of forming a semiconductor device includes forming a base leadframe having a plurality of leads and a die pad. A cavity is formed in each lead of a set of leads of the plurality of leads. Bond pads of a first semiconductor die are interconnected with respective leads of the plurality of leads. A metal core connector is placed on each cavity of the set of leads. A packaged device is mounted on the base leadframe by way of the metal core connectors. The packaged device includes a second semiconductor die mounted on package leads of a package leadframe. A first encapsulant encapsulates the second semiconductor die and package leadframe. A portion of each of the package leads is exposed through the first encapsulant. A second encapsulant encapsulates the first semiconductor die, a portion of the base leadframe, and a portion of the packaged device.