Hybrid Semiconductor Package Structure for Thin High-Signal Interposers
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Solution Overview
Problem
Conventional BGA packages are thick and expensive, limiting their use in high-performance electronic devices due to their high cost and thickness, which hinders the achievement of low-cost, high-performance signal characteristics.
Innovation Solution
A hybrid semiconductor device is developed, featuring an interposer substrate with a semiconductor package and a stiffener, utilizing a coreless or core multilayer substrate to reduce thickness and improve signal integrity, along with a molding member to protect the semiconductor chip and enhance heat dissipation, while buffering circuit width differences between the package and the main board at a lower cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thick PCB substrate is used to provide improved signal integrity, then signal characteristics are improved, but the overall device thickness increases and cost increases
Solution Approach 1:
The device is divided into multiple functional layers: a thin package substrate for mounting the semiconductor chip, an interposer substrate with circuit patterns for signal routing, and a stiffener layer for mechanical support. This segmentation allows each layer to be optimized independently - the package substrate can be thin without compromising overall structural integrity, while the interposer provides the necessary signal integrity through its circuit design rather than relying on substrate thickness alone.
Solution Approach 2:
The package substrate uses a composite structure combining a thin core layer with surface layers that provide electrical connectivity. This composite approach allows the substrate to achieve both thinness and adequate mechanical/electrical performance by leveraging the strengths of different material layers rather than requiring a single thick homogeneous substrate.
2Reliability
If a conventional thick PCB substrate is used to provide improved signal integrity, then signal characteristics are improved, but manufacturing cost increases
Solution Approach 1:
By segmenting the substrate system into a thin package substrate and a separate interposer substrate, the manufacturing process can use thinner, less expensive materials for the package substrate while the interposer - which requires higher performance - can be manufactured separately and attached. This reduces overall material costs compared to using a single thick high-performance substrate throughout.
Solution Approach 2:
The interposer substrate acts as an intermediary between the thin package substrate and the final PCB assembly. It provides the high-performance signal routing capabilities that would otherwise require a thick substrate, but does so in a separate, optimized component that can be manufactured more efficiently and attached to the thin package substrate, reducing overall manufacturing cost.
3Stability of the object's composition
If a stiffener is added to the interposer substrate to provide mechanical support, then structural stability is improved, but device complexity increases
Solution Approach 1:
The stiffener is merged with the interposer substrate to form an integrated assembly. The stiffener is positioned on the interposer substrate and works in conjunction with the circuit patterns already present, providing mechanical support without requiring separate mounting operations or additional structural components. This merging reduces overall assembly complexity while maintaining structural stability.
Solution Approach 2:
The stiffener serves multiple functions: it provides mechanical support to the thin package substrate, maintains the structural integrity of the interposer assembly during handling and assembly, and helps define the mechanical interface with the final PCB mounting location. This multi-functionality reduces the need for additional specialized components, simplifying the overall device structure.
Data Source
AI summary
A hybrid semiconductor device includes an interposer substrate, a semiconductor package mounted on the interposer substrate, a molding member on the package substrate covering at least a portion of the semiconductor chip and exposing an upper surface of the semiconductor chip, and a stiffener disposed on an upper surface of the interposer substrate substantially around the semiconductor package.