Hybrid Metal-Core PCB Rectifier for Compact EV Wireless Charging
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Solution Overview
Problem
Conventional wireless inductive charging systems for electric vehicles have bulky rectifier circuits with thick passive components and heat pipes, which occupy valuable space and limit placement options due to their size and heat dissipation requirements.
Innovation Solution
A streamlined rectifier apparatus is developed using a first printed circuit board with multiple layers, including a metal layer for heat dissipation and a second non-metallic substrate board with inductors, eliminating the need for heat pipes and utilizing thin surface-mount capacitors and inductors to reduce vertical space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional rectifier circuits with thick passive components and heat pipes are used, then heat dissipation capability is improved, but device volume increases and occupies valuable space
Solution Approach 1:
The patent combines the heat dissipation function with the circuit board structure by using a metal core PCB that integrates thermal management directly into the board substrate, eliminating the need for separate heat pipe components and reducing overall device volume while maintaining effective heat dissipation
Solution Approach 2:
The metal core PCB serves multiple functions simultaneously: it provides mechanical support for circuit components, establishes electrical connections through copper traces, and acts as a heat dissipation pathway, thereby consolidating multiple components into a single multi-functional structure that reduces device volume
2Power
If conventional rectifier circuits with thick passive components are used, then power handling capability is improved, but device volume increases and placement flexibility decreases
Solution Approach 1:
The patent transitions from traditional three-dimensional bulky components to a planar two-dimensional circuit board layout, allowing power handling components to be distributed across the board surface area rather than occupying vertical space, thereby maintaining power capability while reducing device volume and improving placement flexibility
Solution Approach 2:
The patent changes the physical parameters of passive components by using thin-film deposition techniques to create capacitors and inductors with reduced thickness and volume, while maintaining their electrical characteristics and power handling capability through optimized trace geometry and material selection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes the vertical space needed for the rectifier assembly, providing efficient heat dissipation and compact design, enabling placement in constrained vehicle locations while maintaining high power output capabilities.
Implementation Method 1
a metal layer, a dielectric layer provided on a surface of the metal layer... providing efficient heat dissipation
Implementation Method 2
a plurality of inductors formed in the non-metallic substrate, each inductor comprised of a magnetic core and a plurality of metallic windings... to provide direct current (DC) power
Data Source
AI summary
A rectifier apparatus for a wireless inductive charging system includes a first PCB having a metal layer, a dielectric layer provided on a surface of the metal layer, and a circuit layer provided on an opposite surface of the dielectric layer relative to the metal layer, the circuit layer including copper traces and circuit components, the circuit components including a capacitor array. The apparatus includes a second PCB having a non-metallic substrate and a plurality of inductors formed in the non-metallic substrate, each inductor comprised of a magnetic core and metallic windings, where the plurality of inductors are electrically coupled forming an inductor array. The circuit layer of the first PCB and the inductor array of the second PCB are electrically coupled to form a rectifier circuit to provide DC power. The circuit layer and the inductor array can be electrically coupled via aligned contact pads on each PCB.