Hybrid SIMM DIMM Memory Module Connector Design
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Solution Overview
Problem
The increasing demand for higher-speed and larger-capacity memory devices in compact computer systems poses challenges in mounting multiple memory devices on existing main boards, requiring innovative memory module designs that can accommodate different signal transmission configurations for write and read operations without needing distinct types of memory modules.
Innovation Solution
The design of memory modules that integrate both single in-line memory module (SIMM) and dual in-line memory module (DIMM) structures, with SIMM-type contacts at the ends and DIMM-type contacts at the center, allowing for serial communication and daisy chain signal transmission using different pins for write and read operations, enabling a single type of memory module to be used in memory systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate SIMM and DIMM memory modules are used for different signal transmission configurations, then write and read operations can be supported, but the device complexity and number of module types increase
Solution Approach 1:
The patent combines SIMM-type contacts and DIMM-type contacts into a single memory module structure. The connector includes both SIMM contacts at the ends and DIMM contacts at the center, allowing one module to support both signal transmission configurations that previously required separate module types.
Solution Approach 2:
The unified memory module design makes a single module type capable of performing multiple functions - supporting both SIMM-style serial daisy-chain transmission and DIMM-style parallel transmission through its integrated contact structure, eliminating the need for different module types for different operations.
2Reliability
If multiple types of memory modules are manufactured for different configurations, then specific signal routing requirements are met, but manufacturing costs increase
Solution Approach 1:
By merging SIMM and DIMM contact structures into one module, the patent reduces the number of distinct module types that need to be manufactured, maintained, and inventoried, thereby lowering manufacturing complexity and costs while preserving accurate signal routing capabilities.
Solution Approach 2:
The universal memory module design allows manufacturers to produce a single standardized module type that can be used for both write operations (SIMM-style) and read operations (DIMM-style), simplifying the manufacturing process and reducing costs compared to producing separate specialized modules.
3Productivity
If SIMM-type contacts are used at both ends for serial transmission, then daisy chain signal flow is achieved, but signal transmission speed is limited
Solution Approach 1:
The patent segments the contact structure into different functional zones: SIMM-type contacts at the end portions for serial daisy-chain transmission, and DIMM-type contacts at the center for parallel transmission, allowing each segment to optimize for its specific transmission mode.
Solution Approach 2:
Different portions of the connector are assigned different contact types based on their functional requirements - the end portions use SIMM-type contacts optimized for serial input/output, while the center uses DIMM-type contacts optimized for parallel transmission, giving each local region the quality it needs for its specific purpose.
Data Source
AI summary
A memory module includes a body with a plurality of memory chips mounted thereon and an elongated connector protruding from the body. The elongated connector includes a plurality of single in-line memory module (SIMM)-type contacts at first portions along an edge thereof and a plurality of dual in-line memory module (DIMM)-type contacts at second portions along the edge thereof. The plurality of SIMM-type contacts may be positioned at opposing end portions of the elongated connector, and the plurality of DIMM-type contacts may be positioned between the opposing end portions. Related memory systems including a system board having a socket therein configured to receive the memory module are also discussed.