I-Shaped Heat Sink Base for IC Thermal Dissipation
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Solution Overview
Problem
The challenge lies in effectively dissipating thermal energy from high-performance, small-form-factor integrated circuit (IC) packages, as conventional heat sinks are difficult to mount precisely on these smaller packages due to size constraints, limiting thermal performance.
Innovation Solution
A heat sink with an I-shaped base and fins, coupled with a ceramic substrate having a groove to accommodate the IC package, allows for efficient thermal energy removal through high thermal conductivity materials like aluminum or copper, and an adhesive with high heat transfer characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large heat sink is used to dissipate thermal energy from high-performance IC packages, then thermal dissipation performance is improved, but mounting precision and interface control become difficult
Solution Approach 1:
The heat sink base is segmented into an intermediate portion and two side portions with different widths. The intermediate portion has a first width that matches the IC package footprint, while the side portions extend outward with a second width larger than the first width to provide mounting stability. This segmentation allows the heat sink to be precisely mounted on small IC packages while maintaining ease of installation.
2Ease of operation
If the heat sink base width is increased to facilitate mounting, then ease of operation is improved, but the interface control with the IC package becomes difficult
Solution Approach 1:
Different portions of the heat sink base have different widths tailored to their specific functions. The intermediate portion has a narrower first width optimized for precise interface contact with the IC package, while the side portions have a wider second width optimized for mounting stability and ease of operation. This local differentiation resolves the contradiction between ease of mounting and interface control precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient thermal energy dissipation during IC operation and testing, addressing the challenge of mounting large heat sinks on small IC packages by ensuring precise interface control and improved thermal performance.
Implementation Method 1
A heat sink according to this aspect of the present disclosure comprises a base and a plurality of fins disposed on the base... the heat sink to remove the thermal energy produced by the operation of the integrated circuit package on the heat sink
Implementation Method 2
A heat sink according to this aspect of the present disclosure comprises a base and a plurality of fins disposed on the base... efficient thermal energy removal through high thermal conductivity materials
Data Source
AI summary
An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width larger than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuit package.