IC Card Module Layout for Bend-Resistant Fingerprint Sensing
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Solution Overview
Problem
Hybrid IC cards with integrated fingerprint sensors and IC chips face increased production steps and costs due to separate wiring connections, and are prone to communication failure from bending, especially with anisotropic conductive films.
Innovation Solution
An IC module design with a substrate through hole connecting a contact terminal to an IC chip, and a fingerprint sensor fixed to a holding portion with a gap, using conductive materials and different melting point solders for fixation, integrated with a booster antenna for contactless communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fingerprint sensor is provided separately from the IC module and connected via wiring mechanism, then fingerprint authentication function is achieved, but the number of production steps and production costs increase
Solution Approach 1:
The patent integrates the fingerprint sensor and IC chip into a single IC module unit, eliminating the need for separate wiring connections between the fingerprint sensor and IC chip. This merging of components reduces the number of production steps while maintaining the fingerprint authentication function.
Solution Approach 2:
The IC module is designed to perform multiple functions including contactless communication, contact communication, and fingerprint authentication, all within a single integrated unit. This multi-functionality eliminates the need for separate wiring mechanisms for different functions.
2Reliability
If anisotropic conductive film is used to mount IC chip and fingerprint sensor, then electrical connection is achieved, but the film is likely to be peeled off when force is applied due to bending
Solution Approach 1:
The patent integrates the fingerprint sensor and IC chip into a single rigid IC module structure, eliminating the need for flexible anisotropic conductive films that are prone to peeling during bending. The integrated structure provides inherent mechanical strength and connection reliability.
3Ease of manufacture
If fingerprint sensor and IC chip are mounted separately using anisotropic conductive film, then both components are connected to substrate, but communication fails when card is bent due to film peeling
Solution Approach 1:
The patent combines the fingerprint sensor and IC chip into a single integrated IC module that is mounted as one unit on the substrate. This eliminates the use of anisotropic conductive films and ensures communication stability even when the card is bent, as the rigid integrated structure maintains reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces production steps and costs while maintaining reliable communication, even under bending stress, by integrating the IC chip and fingerprint sensor efficiently.
Implementation Method 1
the contact terminal is electrically connected to the IC chip via the through hole
Implementation Method 2
the fingerprint sensor is electrically connected to the IC chip via the holding portion
Implementation Method 3
different melting point solders for fixation
Data Source
AI summary
The present invention is an IC module including: a substrate having a through hole; a contact terminal provided on a first surface of the substrate; an IC chip provided on a second surface of the substrate; a holding portion fixed to the substrate and projecting from the substrate; and a fingerprint sensor fixed to the holding portion, wherein the contact terminal is electrically connected to the IC chip via the through hole, and the fingerprint sensor is electrically connected to the IC chip via the holding portion.