Integrated Circuit Conductive Studs Eliminate Wire Bonds
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Solution Overview
Problem
Conventional integrated circuits with wire bonds are delicate, time-consuming to connect, prone to damage from electromagnetic interference, and increase parasitic capacitance and inductance, making them susceptible to contamination and manufacturing challenges.
Innovation Solution
The integration of conductive studs and a printed wiring board with dielectric layers and conductive layers that connect the die to a connection mechanism without wire bonds, allowing for early encapsulation and reduced lead lengths, thereby minimizing damage and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used to connect the die to the lead frame, then electrical connection is achieved, but the circuit becomes delicate and susceptible to damage from electromagnetic interference
Solution Approach 1:
The patent extracts and eliminates the wire bonds from the integrated circuit structure, replacing them with a lead frame that has conductors directly connected to the die through conductive pads. This removal of the wire bonds eliminates the source of electromagnetic interference susceptibility and handling delicacy while maintaining the essential electrical connection function.
2Reliability
If wire bonds are used to connect the die to the lead frame, then electrical connection is achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent removes the wire bonding process entirely from the manufacturing sequence. Instead of requiring separate wire bonding steps, the die is directly mounted onto the lead frame with conductive pads that provide immediate electrical connection, significantly reducing manufacturing time and complexity.
Solution Approach 2:
The patent merges the electrical connection function into the mechanical mounting process. The lead frame structure integrates both mechanical support and electrical connection capabilities, allowing the die to be attached once while simultaneously establishing both mechanical and electrical connections, eliminating the need for separate wire bonding operations.
3Reliability
If the die is connected to the lead frame before encapsulation, then electrical connection is established, but the die and components are vulnerable to contamination
Solution Approach 1:
The patent performs the die mounting and electrical connection establishment before the encapsulation process. The die is securely attached to the lead frame with conductive pads, and the entire assembly is then encapsulated in a protective coating. This preliminary action ensures that electrical connections are established while the structure is still accessible, and subsequent encapsulation provides permanent protection against contamination.
4Reliability
If wire bonds are used, then electrical connection is achieved, but parasitic capacitance and inductance increase
Solution Approach 1:
The patent extracts and eliminates the wire bonds that generate parasitic capacitance and inductance. By replacing them with direct conductor connections through the lead frame, the patent removes the sources of these harmful electromagnetic properties, resulting in cleaner signal transmission and reduced interference.
Data Source
AI summary
Methods of fabricating integrated circuits are disclosed herein. A die having a side is provided. A conductive stud extends from the side in a direction that is substantially normal to the side. A first dielectric layer is affixed to the side of the die. The first dielectric layer has a first side and a second side. The first side of the first dielectric layer is affixed to the side of the die. The conductive stud pierces the first side of the first dielectric layer. A first via is formed through the first dielectric layer between the conductive stud and the second side. The first via is electrically connected to the conductive stud.