IC Contact Structure Isolation for Flexible Fin Routing

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Solution Overview

Problem

Existing IC designs face challenges in achieving increased routing flexibility between IC components due to the lack of isolation between fin structures and overlying contacts, limiting the separation of power rails and signal traces.

Innovation Solution

The implementation of an isolation layer between a fin structure and an overlying contact in the IC layout, allowing for the formation of an electrical connection between vias and fin structures while isolating them, thereby enabling increased routing flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If no isolation layer is formed between fin structure and contact, then manufacturing process is simpler, but routing flexibility is limited

Engineering Contradiction:

Improverouting flexibilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

An isolation layer is introduced as an intermediary component between the fin structure and the contact. This isolation layer acts as a mediator that enables routing flexibility by allowing the contact to be electrically isolated from the fin structure, thereby enabling independent routing paths for power rails and signal traces without increasing overall manufacturing complexity

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If isolation layer is added between fin structure and contact, then routing flexibility increases, but manufacturing complexity increases

Engineering Contradiction:

Improverouting flexibilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The contact structure is segmented into multiple components: the contact itself, the isolation layer, and the fin structure. This segmentation allows each component to be independently formed and controlled, enabling routing flexibility while managing manufacturing complexity through a systematic multi-step process

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If power rails are separated by three signal traces and four metal spaces, then routing flexibility is enhanced, but manufacturing precision requirements increase

Engineering Contradiction:

Improverouting flexibilityVSAvoidlayout precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The layout design utilizes multiple dimensions and layers to achieve power rail separation. By distributing signal traces and metal spaces across different spatial dimensions and layers, the design achieves enhanced routing flexibility while managing precision requirements through three-dimensional layout optimization

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12581939B2Contact structure manufacturing method

Publication Date: 2026.03.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method of manufacturing an integrated circuit (IC) structure includes forming an opening in a first dielectric material between a first gate structure and a second gate structure by removing a portion of the first dielectric material overlying a fin structure; filling at least part of the opening with a second dielectric material; and forming a contact overlying the fin structure and the second dielectric material.